FOR IMMEDIATE RELEASE                            Contact: Jim Bruorton
(864) 963-6621

            52nd Electronic Components & Technology Conference
                              Call for Papers

   (San Diego, California .....August 1, 2001)--The 52nd Electronic
Components & Technology Conference will be held at the Sheraton San Diego
Hotel and Marina in San Diego, California on May 28 - 31, 2002.
   This conference offers papers covering a wide spectrum of topics,
including not only electronic components, but also exciting new
developments in all areas of electronics technology (e.g., electronics
assembly, packaging, systems packaging, components, reliability and
materials). In 2001, over 250 papers and posters, and 14 short courses were
presented by companies, universities and research institutions from around
the world.
   The consistent goal of the conference is to offer quality coverage of
technological innovations in the areas of packaging design, materials,
processes, quality and manufacturing of devices, components and systems.
The Program Committee represents a wide variety of disciplines and
expertise from the electronics industry. We are committed to assembling the
highest quality program for the 52nd ECTC, and we need many excellent
papers to do the job.

                           Major Topics for ECTC
Advanced Packaging:
New packaging technologies, designs, materials and configurations
addressing performance density and cooling for single chip, multichip,
wafer level, MEMS and power packages. Special emphasis on flip-chip, fine
pitch and high lead count packaging in CSP, BGA , CGA, LGA, SMT packages.
Components & RF:
New passive or active component technologies, integrated/embedded
components, RF & wireless component applications, component performance,
and systems and reliability.
Connectors & Contacts:
New or improved devices or techniques, emphasis on high density and
performance for multichip, surface mount applications, and meeting computer
and telecommunication evolving requirements.
Education:
Education for engineering curricula in the 21st century and collaborative
research and engineering programs between universities, government, or
industry; development and the use of multi-media for packaging education.
Interconnections:
First level electronic interconnection technologies including, flip-chip,
wirebonding, TAB and conductive polymers for temporary or permanent
interconnects; wafer, device and substrate-level interconnection
metallizations and MEMS interconnects.
Manufacturing Technology:
Processes and equipment for wafer thinning, bumping and stacking, chip
packaging, high density and embedded component substrates, test and
burn-in. Emphasis on cost, yield, performance and environmental
improvements, process characterization, new product introduction and ramp,
design for flexible manufacturing and testing.
Materials & Processing:
Technology, development and applications of adhesives, encapsulants flip
chip underfills, solders and alloys, magnetic, thermal and optical
materials; ceramics, composites, dielectrics, thin films, integrated
passives, joining metals and plating developments.
Modeling & Simulation:
Electrical, thermal, optical, mechanical modeling, simulation, and
characterization and packaging solutions, including system-level
applications
OptoElectronics:
Packaging for fiber-optic modules, infra-red wireless, consumer
opto-electronics, flat-panel, projection and micro-displays optical
amplifiers, lasers, detectors, waveguides OEICs, and passive components,
WDMs.
Posters:
Papers may be submitted on any of the listed major topics; presentation of
papers in a poster format is highly encouraged.
Quality & Reliability:
Assessment, failure analysis, reliability testing and data analysis,
accelerated models, qualification of components and systems, KGD
incremental quality improvement, TQM.

Short Courses:
Proposals are also solicited from individuals interested in teaching
educational short courses (~4 hours) on topics described in the Call for
Papers. Proposals including course descriptions must be submitted to Larry
Mann, KEMET Electronics, P.O. Box
849, Fountain Inn, SC 29644-0849, Ph: (864) 409-5746, larrymann@kemet.com,
by 15 October, 2001

                             Paper Submission
   A 750 word abstract describing the scope, content, uniqueness and key
points may be submitted via the website (preferred), www.ectc.net, email,
facsimile, or the U.S. mail. Submissions should be in the preferred Adobe
Acrobat (pdf), html or MS Word format. We will also accept WordPro or ascii
(text) formats. Please check the website on how to submit papers
electronically. The paper must consist of work not published or previously
presented, and avoid the inclusion of commercial content. Both oral or
poster presentations are given at the conference. Papers will be accepted
as oral or poster presentations  based on the abstract received and the
judgment of the Technical Program Committee. Both forms of presentation
require a manuscript. Send a copy of the abstract and no more than two
subcommittee suggestions (for which you wish the paper to be considered)
with your phone number, email address of the presenting author(s),
affiliations of all authors, and facsimile number with your submission by
October 15, 2001 to:

   Steve J. Bezuk
   Kyocera America Inc.
   8611 Balboa Ave.
   San Diego, CA 92123 USA
   Phone: (858) 576-2651
   Fax: (208) 439-4316
   Email: steve.bezuk@kyocera.com

   Authors will be notified of paper acceptance with instructions for
publication by December 15, 2001. Manuscripts are due in final form for
publication in the Conference Proceedings by February 15, 2002.


The 52nd ECTC conference is sponsored jointly by the Electronic Components,
Assemblies, and Materials Association (the electronic components sector of
the Electronic Industries Alliance) and the IEEE Components, Packaging and
Manufacturing Technology Society.

A flyer that you can give to a colleague or post in your workplace.