The EMAP2001 symposium is organized by the Korea Advanced Institute
of Science and Technology(KAIST). And it is also jointly sponsored
by the IEEE-Component, Packaging and Manufacturing Technology
(CPMT), IMAPS-Korea, Korea Society of Mechanical Engineers, The
Institute of Electronics Engineers of Korea(IEEK), and ASME Korea
Section.
Following the tremendous success in the last two EMAP conferences
in Singapore and Hong Kong, which were attended by delegates from
10 major countries, the third symposium will be held in Korea.
It will be one of the major conferences on electronic materials
and packaging ever to be held in Korea. Meet world-renowned exports
from the Asia-Pacific region, USA and Europe. Join us and get
in touch with leading-edge technologies, and find out more about
Korea's electronic packaging industries.
Major Topics of Symposium
l Advanced Electronic Packaging Technologies: Wafer Level Packaging,
Flip Chip, CSP, DCA, MCM
l Packaging Materials and Processes: Lead-free Solders, Adhesives,
Underfills, Encapsulants, PCBs
l Interconnect Technologies: Wire bonding, Fine Pitch, Micro via,
Build-up Technologies
l Materials Characterization, Testing and Measurements: Electrical,
Thermal, Chemical, Mechanical
l Thermal Management of Packaging
l Package Design, Modeling and Simulation
l Sensors and MEMS Packaging
l Reliability and Failure Analysis: Interfacial Phenomena, Delamination,
Moisture effects Polymers and Ceramics for Electronic Applications,
Thin films/coatings, Metallization
Important Dates
July 31, 2001 Abstract submission
August 15, 2001 Notification of abstract acceptance
September 30, 2001 Full manuscript due
October 15, 2001 Registration/hotel accommodation
Abstracts and Papers
An electronic form(MS-Word format) of one-page 300 words abstract
with name, address, phone/fax number, and e-mail address should
be submitted to the Secretariat of Symposium, emap2001@me.kaist.ac.kr
by July 31, 2001. Details of further information including registration
and accommodation will be announced later through the EMAP2001
homepage http://me.kaist.ac.kr/~emap2001.