The 3rd International Symposium on Electronics Materials and Packaging 2001 (EMAP2001)

November 19-22, 2001
HYATT REGENCY CHEJU, Cheju Island, KOREA


The EMAP2001 symposium is organized by the Korea Advanced Institute of Science and Technology(KAIST). And it is also jointly sponsored by the IEEE-Component, Packaging and Manufacturing Technology (CPMT), IMAPS-Korea, Korea Society of Mechanical Engineers, The Institute of Electronics Engineers of Korea(IEEK), and ASME Korea Section.
Following the tremendous success in the last two EMAP conferences in Singapore and Hong Kong, which were attended by delegates from 10 major countries, the third symposium will be held in Korea. It will be one of the major conferences on electronic materials and packaging ever to be held in Korea. Meet world-renowned exports from the Asia-Pacific region, USA and Europe. Join us and get in touch with leading-edge technologies, and find out more about Korea's electronic packaging industries.

Major Topics of Symposium
l Advanced Electronic Packaging Technologies: Wafer Level Packaging, Flip Chip, CSP, DCA, MCM
l Packaging Materials and Processes: Lead-free Solders, Adhesives, Underfills, Encapsulants, PCBs
l Interconnect Technologies: Wire bonding, Fine Pitch, Micro via, Build-up Technologies
l Materials Characterization, Testing and Measurements: Electrical, Thermal, Chemical, Mechanical
l Thermal Management of Packaging
l Package Design, Modeling and Simulation
l Sensors and MEMS Packaging
l Reliability and Failure Analysis: Interfacial Phenomena, Delamination, Moisture effects Polymers and Ceramics for Electronic Applications, Thin films/coatings, Metallization

Important Dates
July 31, 2001 Abstract submission
August 15, 2001 Notification of abstract acceptance
September 30, 2001 Full manuscript due
October 15, 2001 Registration/hotel accommodation

Abstracts and Papers
An electronic form(MS-Word format) of one-page 300 words abstract with name, address, phone/fax number, and e-mail address should be submitted to the Secretariat of Symposium, emap2001@me.kaist.ac.kr by July 31, 2001. Details of further information including registration and accommodation will be announced later through the EMAP2001 homepage http://me.kaist.ac.kr/~emap2001.