A brief report from the

4th International Symposium Electronic packaging
Technolgy(ISEPT) in Beijing 8/ 8 - 12 /2001

The IEEE CPMT cosponsored the 4th International Symposium Electronic Packaging
Technology (ISEPT) which was held in Beijing's Friendship Hotel from August 8-12, 2001.
Over 160 people from 10 countries -- China, US, Japan, England, Sweden,
Finland, Hong Kong, Taiwan, Korea, and Singapore -- were present, and over 70
technical papers were presented there.

The conference covered Advanced Packaging Technologies, Maufacturing Technologies, Packaging Materials,
Components, Interconnection Technologies, MEMS, Packaging Design, Modeling
and Simulations, Reliability and Testing, as well as Environment Technologies.The
conference was chaired by Prof. Ke Gong of Tsinghua University and
cochaired with Prof. CP Wong of Georgia Tech and Prof. Sheng Liu of Wayne
State. Prof. S. Mma was the program chair. Brief tutorials on Polymers
for Electronic Packaging, and Photonic and MEMS Packaging were conducted by
CP Wong of GIT and Sheng Liu of Wayne State.

Submitted by CP Wong, CPMT International Liaison
Professor C.P. Wong
Regents' Professor
School of Materials Science & Engineering
Georgia Institute of Technology
771 Ferst Drive
Atlanta, GA 30332-0245
(404) 894-8391 Phone
(404) 894-9140 FAX
cp.wong@mse.gatech.edu