Call for Abstracts
Abstract Deadline:
November 19, 2001
INTERNATIONAL
WORKSHOP ON
WAFER
LEVEL CSP AND FLIP CHIP PACKAGING
Evergreen Marriott Conference Resort
at Stone Mountain Park
Stone Mountain, Georgia, USA
March 1-3, 2002
Proposed Sponsors
IEEE Components, Packaging and Manufacturing
Technology Society (IEEE-CPMT)
ASME Electrical and Electronics
Packaging Division (ASME-EEPD)
MRS
American Ceramic Society
IZM, Germany
Packaging Research Center
GENERAL CHAIR:
Rao Tummala
Georgia Institute of Technology
rao.tummala@ee.gatech.edu
TECHNICAL PROGRAM CHAIRS:
Mahadevan K. Iyer
IME, Singapore
iyer@ime.org.sg
CP Wong
Georgia Institute of Technology
cp.wong@mse.gatech.edu
Michael Toepper
IZM, Germany
toepper@izm.fhg.de
Abstract Submission:
Please send your abstract electronically
to wlp@ee.gatech.edu
by November 19, 2001: