EuroSimE 2002 Call for Papers
15-16 April 2002
Paris

BACKGROUND
Microelectronics plays a vital role in the modern human life and society. Miniaturisation and function integration is the ongoing trend for microelectronic industry. Since 1965, Moore's law has been proving to be valid, forecasting that "the density of chip circuitry doubles every 18 to 24 months".

As one of the consequences, many thermal and mechanical related problems and unknowns are challenging both research and application engineers with significantly negative economic and social impact. This is due to the fact that the existing mechanical and thermal knowledge cannot cope with the needs and rapid development of microelectronic industry. To some extend thermal and mechanical related problems are becoming the bottleneck for further development of microelectronic industry.

As the only international conference specially dedicated to find the Thermal and Mechanical Solutions for Microelectronics, EuroSimE 2002 aims to:
· promote further development and application of advanced thermal and mechanical theories, methodologies and tools for microelectronics.
· draw attention from the academic community world-wide for the mechanics challenges driven by microelectronic industry.
· improve communication and exchange information between methodology & tool-developers and industry users.
· strengthen co-operation between industry, universities, and research institutes.

CONFERENCE FEATURES
Short courses (April 14, 2002)
Short courses will be offered for professional training, and the subjects will be announced later.

Panel session
Leaders in the microelectronics area will be invited to participate in panel session on major technical and business challenges.

Technical sessions (April 15-16, 2002)
Both speaker and poster sessions will be organised.

Exhibition (April 15-16, 2002)
A parallel exhibition from industrial contributors and simulation and optimisation software companies will be organised.

TECHNICAL SCOPE
EuroSimE 2002 will address the results of both fundamental research and industrial application for various thermal and mechanical issues in microelectronics. This includes, but is not limited to:
· mechanical simulation (both static and dynamic),
· thermo-mechanical simulation,
· thermal simulation,
· material characterisation experiments and modelling,
· thin-film mechanics,
· failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
· fracture, continuum, and micro-mechanics in microelectronics,
· interface strengths,
· experiments for model verification,
· simulation in reliability engineering,
· microelectronic product and/or process optimisation,
· simulation-based optimisation,
· simulation for reliability improvement/failure prediction,
· virtual and accelerated reliability qualification,
· design rule development via simulation,
· virtual prototyping in product and/or process design,
· from micro to macro simulation,
· multi-physics simulation,
· advanced numerical and analytical simulation methodologies and tools.

The applications will cover all fields of microelectronics, including, but not limited to:
· Wafer processing and chip design,
· PWB design and application,
· Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS),
· Microsystems,
· Interconnections,
· Systems,
· Materials of microelectronics,
· Processes in microelectronics

ABSTRACT SUBMISSION
You are invited to submit an abstract of about 500 words by fax, mail, or email describing the scope, content, and key points (originality, specific results, potential impact) of your proposed paper to:

COMPETE Network Co-ordination
MTA Marketing & Technologies Avancees
42 Rue Vignon
75009 Paris, France
Attn. Mr. Olivier de Saint Leger
Tel: 33 1 44517400
Fax: 33 1 44517401
Email: Compete@mta.fr
Web: www.eurosime.com

Abstracts must be received by Nov. 15, 2001. Please ensure that the presenting author's name is underlined in the author list, along with the full address (including e-mail if available) of the authors.

Authors will be notified of acceptance by Dec. 1, 2001.

MANUSCRIPT SUBMISSION
The manuscript should be submitted before Feb. 1, 2002 for publication in the conference proceeding, and possible publication in the IEEE Transactions of CPMT. The guidelines for manuscripts will be given soon at the conference Internet site (www.eurosime.com).

REASONS FOR PARTICIPATING
· To get a unique chance to understand the impact of thermal and mechanical issues on your business profitability
· To listen to, share, and discuss thermal and mechanical problems and challenges in microelectronics, and to find the solutions to these problems
· To obtain effective and efficient thermal and mechanical methodology overviews and training
· To obtain a review of the state-of-the-art and perspectives in thermal and mechanical simulation and experimental methodologies
· To become acquainted with thermal and mechanical simulation and experiments, and also the specialists who develop, apply, and benefit from this technology
· To learn from the experiences of international thermal and mechanical experts from industry, universities, and research institutes

PARTICIPANT BACKGROUND
· Project, product, and IT managers,
· Reliability specialists,
· Thermal & mechanical analysts, CAD engineers,
· Microelectronics designers,
· Teachers, researchers, and postgraduate students

General Chairman and Co-Chairman
Dr. G.Q. Zhang, Center for Industrial Technology (CFT)/Philips, The Netherlands
O. de Saint Leger, MTA, France

International Advisory Committee
Mr. H. Frima, European Commission, Belgium
Dr. D. H. van Campen, TU/e, The Netherlands
Dr. J. Lau, HP, USA
Dr. T. W. Mak, Dallas Semiconductor, USA
Dr. E. Suhir, Iolon, USA
Dr. Y. Sung, NTU, Singapore
Dr. C.P. Wong, Georgia Tech, USA

Technical Committee
Chairman and co-chairman
Dr. L.J. Ernst, TUD, the Netherlands
Dr. R. Dudek, IZM, Germany
Members
Dr. D. R. Andersson, IVF, Sweden
Dr. F. Christiaens, Alcatel, Belgium
Dr. K. Chiang, TsingHua University, Taiwan
Dr. A. Dasgupta, Maryland University, USA
Dr. X.J. Fan, Philips, USA
Dr. M. G.D. Geers, TU/e, The Netherlands
Dr. M. Ignat, INPG/LTPCM, France
Dr. R. Lee, Hong Kong University of Science & Technology, China
Dr. Y.L. Li, NPU, China
Dr. S. Liu, Wayne University, USA
Dr. E. Madenci, University of Arizona, USA
Dr. S. Marco, Universitat de Barcelona, Spain
Dr. L. Mercado, Motorola, USA
Dr. M. Meuwissen, TNO, The Netherlands
Dr. W. Nuechter, Robert Bosch GmbH, Germany
Dr. H. Pape, Infineon, Germany
Dr. S.H. Pulko , Hull University, UK
Dr. T. Reinikainen, Nokia, Finland
Mr. B. Schwarz, Siemens, Germany
Dr. A. Schubert, IZM, Germany
Dr. S. K. Sitaraman, Georgia Tech, USA
Ms. O.F. Slattery, NMRC, Ireland
Dr. S. Yu, Tsinghua University, Beijing, China
Dr. A. Tay, NUS, Singapore
Dr. J.M.J. den Toonder, Philips, The Netherlands
Mr. B. Vandevelde, IMEC, Belgium
Dr. K. Watanabe, University of Tokyo, Japan
Dr. S. Wiese, Technical University of Dresden, Germany
Dr. I. De Wolf, IMEC, Belgium
Dr. A. Wymyslowski, Wroclaw University of Technology, Poland
Mr. N. Zahlan, ICI, UK
Dr. G.Q. Zhang, Philips, The Netherlands

Short courses Chairman
Dr. M. Meuwissen, TNO, The Netherlands

Finance Chairman and Co-Chairman
Mr. O. de Saint Leger, MTA, France
Dr. I. de Wolf, IMEC, Belgium

Exhibition chairman and Co-Chairmen
Dr. S. Pulko, Hull University, UK
Mr. W. van Driel, Philips, The Netherlands
Dr. A. Wymyslowski, Wroclaw University of Technology, Poland

Publicity Chairman and Co-chairman
Ir. B. Vandevelde, IMEC, Belgium
Dr. D. R. Andersson, IVF, Sweden

Facility Chairman
Mr. O. de Saint Leger, MTA, France

ORGANISED BY
COMPETE/Thematic Network/ EC

SPONSORED BY
Technical co-sponsoring:
· IEEE-CPMT Society
· IUTAM
· IMAPS
Financial co-sponsoring:
· European Commission
· Philips CFT