TWO WEEK SHORT COURSE SERIES

May 13 - 24, 2002

The next offering for the PRC two week short course series is scheduled to May 13-24, 2002. The series will consist of individual modules which will cover systematically and comprehensively all the critical technologies from systems to devices including microelectronics, photonics, MEMS and systems packaging. The modules will be instructed by faculty from Georgia Tech and industry experts.

• RF/Wireless Packaging: Status and Challenges
• Optoelectronics
• MEMS Packaging and Applications
• Integral Passives
• Next Generation Microvia (Hands-on)
• Wafer Scale Packaging
• Low Cost Flip Chip Processing and Analysis (Hands-on)
• Thermal Management of Microelectronic Devices
• Polymers for Microelectronics: Process and Characterization (Hands-on)
• Thermomechanical Reliability
• Signal Integrity with Emphasis on Power Distribution for Digital Systems

Detailed information will be available on the PRC web site, www.prc.gatech.edu, after January 15

--- submitted by Margarita C. Bolet