ITherm 2002 -- June San Diego

This is an invitation to submit an abstract to ITherm 2002 to be
held in San Diego, CA during May 29- June 1, 2002. The deadline for
submission of abstracts is September 15, 2001 and must be entered at the
ITherm 2002 website at http://www.itherm.org/. .

ITherm 2002 Organizing Committee
____________________________________________________
Call for Abstracts

ITherm 2002: Eighth Intersociety Conference on Thermal
and Thermomechanical Phenomena in Electronic Systems
May 29- June 1, 2002
Sheraton San Diego Hotel & Marina, San Diego, California

ITherm 2002 is an international conference that brings together
engineers and scientists from industry, academia and government research
organizations for scientific and engineering exploration of thermal,
thermomechanical and emerging technology issues associated with all
aspects (die to system) of electronic systems: from pagers to cell
phones, from lap-top computers to supercomputers, from consumer and
automotive to space electronics. The objective is to address current
topics in the broad areas of thermal, thermomechanical and
multidisciplinary areas in current and emerging electronic systems.
ITherm 2002 will be co-located with the 52nd Electronic Components and
Technology Conference (ECTC 2002), which offers a broad range of current
and new developments in all areas of electronic technology. In addition
to paper presentations and panel discussions, ITherm 2002 will include
vendor exhibits, keynote lectures by prominent speakers, and
professional short courses. Please visit our web site at
http://www.itherm.org/ for latest conference related information.
Original papers are solicited in general areas of Thermal Management,
Mechanics (thermo-mechanical and mechanical) issues and related issues
in Emerging Technologies.

Thermal:
* Natural and forced convection air-cooling
* Liquid cooling
* Novel cooling techniques: phase change, heat pipes, thermosyphon,
liquid-cooled heat sinks and evaporation
* Microchannel, micro- and nano-scale heat transfer and fluidics
* Thermal management and mechanical issues in high power dissipation
packages and systems including novel heat sinks.
* Active: thermo-electric, air movers, refrigeration
* Thermal aspects of systems-on-a-chip
* Methods for mitigating effects of extreme thermal environments
* New approaches to microelectronics thermal management
* Experimental characterization: methods and measurement techniques in
thermal management, thermal contact resistance, flow and temperature
visualization, performance of thermal interface materials (adhesives,
thermal paste)
* Manufacturing & Assembly Related Transport and Thermo-Mechanical Aspects.
* High Flux Liquid Cooling Techniques Mudawar/Galloway
* Printed Circuit Board Level Thermal Issues for Next Generation Technologies

Mechanics:
* Role of fracture mechanics in electronic packaging
* Solder joint reliability and fatigue: modeling and experimental
* Solder profile modeling, fatigue mechanics of packages, interconnects
* Mechanical reliability of advanced packages, and multilayered
structures manufacturing/assembly and field-use conditions
* Impact and vibrational analysis of packages, sub-systems, and systems
* Experimental methods, model validation, material characterization
* Mechanics of environmental-friendly materials in electronics
& Thermal and thermomechanical characterization of materials: organics
(dielectrics, solder mask, LTCC etc., solders, PB-free solders)
* MEMs & Micromechanics
* Reliability Characterization
* Analytical Methods in Mechanics and thermo-mechnaics

Emerging Technologies: Thermal, Thermomechanical and/or related
underlying multidisciplinary issues in:
* Space systems: earth orbiting and deep-space missions
* Fiber-optics interconnect systems
* Free space optical interconnects
* MEMs: device and package level reliability issues.
* Mechanics, material and process related issues in Nanostructures.
* Portable/handheld electronics, such as cell phone, pager, notebooks,
computers, peripheral hardware, disc drives, displays, printers
* Medical, telecommunication, and automotive systems
* BioElectronics
* Solid-State Cooling: Advanced Thermoelectrics and Photonic Coolers
* Power Electronics Systems
* Nanoscale Phenomena In Electronics

Panel Discussions:
* Proposals are solicited for panel discussion topics addressing
contemporary issues of broad interest to ITherm. These should include a
title, an abstract describing the theme(s) to be addressed, and a list
of potential panelists.

Software Tools/Techniques: Design, Analysis, Simulation
* CAD, CFD, FEA, EDA software tools and trends in their
interoperability.
* Flow network modeling
* Model validation/benchmarking
* Development of behavioral (or compact) models (e.g., component, heat
sinks)
* Interoperability and emerging standards across cross-disciplinary
software tools

To submit a paper for consideration, please enter a 250-word abstract by
September 15, 2001 (try for a late submittal) at the ITherm website at http://www.itherm.org/.

Direct General inquiries to:
Prof. Cristina H. Amon
General Chair, ITherm 2002
Department of Mechanical Engineering
Carnegie Mellon University
Pittsburgh, PA 15123, USA
Email: camon@cmu.edu