2002 IEEE Systems Packaging Japan Workshop
NTT
Musashino R&D Center,Japan
February 4 -February
6, 2002
General Chair:
Tohru Kishimoto
Vice Chair:
Yuzo Shimada
The IEEE Systems Packaging Japan Committee would like to invite
you to participate in the 2002 systems packaging workshop to be
held at the Nippon Telegraph &Telephone (NTT) Musashino R&D
Center, Musashino City, Tokyo, Japan on Feb. 4 Monday through
Feb. 6 Wednesday.The workshop covers the systems packaging technology
from personal systems to high performance systems. Also the committee
is planning special sessions and technical tours.The workshop
will be held in English. All attendees are expected to be specialists
in the field and to participate in discussion. We are confident
that the technical meeting will be rewarding and useful. We are
looking forward to a lot of participants.
2002 IEEE
SYSTEMS PACKAGING JAPAN
WORKSHOP
NTT Musashino
R&D Center
Musashino City,
Tokyo, Japan
Workshop Presented by:
The IEEE Computer Society's & CPMT
Technical Committee: Computer Packaging Japan
2002 IEEE Systems Packaging
Japan Committee
General Chair:
Tohru Kishimoto (NTT)
Vice Chair: Yuzo
Shimada (NEC)
Treasurer: Yoshimitsu
Arai (NTT)
Committee
Members (Japan)
Haruhiko Yamamoto (FUJITSU), Keiichiro
Nakanishi (HITACHI), Kimihiro Yamanaka (IBM)
Yasushi Kodama (IBM), Yutaka Tsukada
(IBM), Masanobu Kohara (MITSUBISHI)
Yuzo Shimada (NEC), Tohru Kishimoto
(NTT), Tetsuo Mikazuki(NTT)
Yoshimitsu Arai(NTT), Tomonori
Sato(ASET), Yutaka Okabe(ASET)
Toshiyasu Takei (OKI), Yuhiko Fujiwara
(OKI), Yoshitaka Fukuoka (DTCT)
Advisers:
Akira Masaki (OKAYAMA
UNIVERSITY)
Kohji Nihei (WASEDA
UNIVERSITY)
Hiroshi Shibata (OSAKA INSTITUTE
OF TECHNOLOGY)
Tadao Ichikawa (TOSHIBA
ENGINEERING)
Toshihiko
Watari (NEC)
Program
Keynote Session
Packaging Technology
in the Future
Chair: Tohru
Kishimoto (NTT)
Co-chairs: TBD,
Kasuga, NEC
Technical Sessions
Session 1 -- High
Performance Systems Packaging
Chair: Yuhiko
Fujiwara(OKI)
Co-chair: George
Katopis (IBM)
Daughter Board Mounting Systems
for IP Network Equipment
Kenichi
Saito
Oki Electric
Industry Co.,Ltd.
Optical Intra-Cabinet
Interconnections
Seiji Karashima
Association of Super-Advanced
Electronics Technologies (ASET)
System packaging technology
of the IBM e-server Z series 900
George
Katopis,
IBM Poughkeepsie
System packaging technology
of the IBM e-server P series 690
TBD
Session 2 -- Packaging Technology
for High Frequency and Wireless Application
Chair: Masanobu Kohara
(MITSUBISHI)
Co-chair: Bob
Pfahl (Motorola)
TBD
(4 papers)
Session 3 -- Packaging Technology
for Personal and Mobile Information Systems
Chair: Keiichiro
Nakanishi (HITACHI)
Co-chair: Bob
Guernsey (IBM)
TBD
(4 papers)
Session 4 -- Packaging Technology
for Optical Communication Systems
Chair: Haruhiko Yamamoto
(FUJITSU)
Co-chair: Iwona
Turlik (Motorola)
TBD
(4 papers)
Session 5 -- Latest News
for Future Packaging Technology
Chair: Yoshitaka
Fukuoka (DTCT)
Co-chair: Len Schaper
(Univ.Arkansas)
System Architecture Implications
of 3-D Interconnect Technologies
Leonard W.Schaper and
Silke A.Spiesshoefer
High Density Electronics Center
(HiDEC)University of Arkansas
TBD
(3 papers)
Session 6 -- Environment,
Safety and Health Technology
Chair: Yuzo
Shimada (NEC)
Co-chair: Erich
Klink (IBM)
Lead-free Soldering
Technology
Katsuaki
Suganuma
Osaka University
New Flame-retarding Epoxy Resin Compounds
without Halogen and their Application to
Electronic
Devices
Yukihiro Kiuchi,and
Masatoshi Iji
Environment Technology Laboratories,NEC
Corporation
TBD
(2 papers)
Special
Sessions
Special Session 1 -- Micro Electronics
Mechanical Systems Technology for Systems Packaging
Chair: Yasushi
Kodama (IBM)
Co-chair:
TDB
TBD
(2 papers)
Special Session 2 -- Electronic
System Integration for Systems Packaging
Chair: Takaaki
Ohsaki (NTT-AT)
Co-chair:TBD
TDB
Osamu
Ibaragi
Association of Super-Advanced
Electronics Technologies (ASET)
TDB
Kenji Takahashi
Association of Super-Advanced
Electronics Technologies (ASET)
GENERAL INFORMATION
Workshop Fee
The 35,000 Yen (US$ 300) fee covers lunches
and drinks from Monday through Wednesday and
two diners,Monday
and Tuesday.
Technical Tour
Telecommunication History Museum
in Musashino R&D Center
By the time you read this the web site should have the detailed program listing and presentations and the names of speakers. Find that information on the web site, as well as registration information. For more information see www.ewh.ieee.org/soc/cpmt/tc14/index.html.