CALL FOR PAPER
International Symposium and Exhibition on
Advanced Packaging Materials
Processes, Properties and Interfaces
Stone Mountain, Georgia, March 3 - 6, 2002
Evergreen Marriott Conference Resort at Stone Mountain Park
Stone Mountain, Georgia, USA

Sponsors:
IEEE Components, Packaging and Manufacturing Technology (CPMT)
Packaging Research Center at Georgia Tech (GT PRC)
Technical Sponsors:
Fraunhofer IZM, Germany
Materials Research Society

General Chair: Dr. Rajen Chanchani, Sandia National Lab, USA
General Chair Elect: Dr. Andreas Schubert, Fraunhofer IZM, Germany
Technical Chair: Professor Jianmin Qu, Georgia Tech, USA
Technical Chair Elect: Dr. Petri Savolainen, Nokia, Finland

Technical Sessions (Session Chairs):
Adhesives (Jim Morris and Ken Gilleo)
Underfills (Quinn Tong and CP Wong)
Encapsulants and Coatings (Ray Pearson and Dan Baldwin)
Bumping (Rolf Aschenbrenner, Dan Scheck and Andrew Strandjord)
Solders (Li Li and Rajen Chanchani)
Substrates, HDI and New Base Substrate Materials incl. Ceramic and Polymer Dielectrics (Petri Savolainen and Daizo Ando)
Reliability (Andreas Schubert and Suresh Sitaraman)
Passive Materials (Larry Mann and Swapan Bhattacharya)
New Topics:Nano Materials, Optical and RF materials (Jianmin Qu and Jim Morris)
Posters (Phil Garrou and CP Wong)

Attendees:
Attendees of this symposium in the past have been comprised of researchers, developers, producers and users of materials for single and multichip packages, interconnections, substrates, microwaves applications, optoelectronic packages and display panels.

For more information, please contact the technical chair of the symposium
Professor Jianmin Qu
School of Mechanical Engineering
Georgia Institute of Technology
Atlanta, GA 30332-0405
Phone: 404-894-5687
E-Mail: jianmin.qu@me.gatech.edu