AMD names RAJ N. MASTER as SENIOR FELLOW

SUNNYVALE, CA-SEPTEMBER 19, 2001-AMD recently named Raj N. Master senior
fellow for the Manufacturing Services Group. Raj is one of four current AMD
employees who have received this honor. As a member of the technical staff
in AMD's C4 and Advanced Assembly Group, Raj played a key role in the
development of AMD's Controlled Collapsed Chip Connection (C4) packaging,
which led to significant savings in packaging and materials for AMD's
microprocessors.

"The backbone of any high-tech company is the technical expertise of its
employees. Raj has consistently proven himself not only as a valuable
contributor who has greatly expanded AMD's technical capabilities, but also
as someone who is helping drive state-of-the-art packaging technologies for
the entire semiconductor industry," said Chuck Anderson, director in AMD's
Manufacturing Services Division.

Raj has spent 26 years working on C4 technology. He joined AMD in 1996 and
was most recently an AMD Fellow responsible for all technical aspects of
AMD's C4 packaging, including assembly process and manufacturing,
reliability, and failure analysis. Raj has been granted 20 U.S. patents and
has published over 75 technical papers. Raj has been very active in the IEEE CPMT Society and SEMATECH.

Raj received a Bachelor's of Engineering degree from M.S. University, Baroda
and a master's degree from the Universtity of Missouri- Rolla, both in
Metallurgical Engineering.