C. P. Wong Earns IEEE EAB Meritorious Achievement Award in Continuing Education

Ching-Ping (C.P.) Wong received the B. S. from Purdue University, and the PhD from Pennsylvania State Univerisity, both degrees in Chemistry. Thereafter, he was awarded a two-year Postdoctoral Fellowship at Standford University with Nobel Laureate Professor Henry Taube.

C. P. Wong is a Regents' Professor at the School of Materials Science and Engineering and a Research Director at the National Science Foundation (NSF) Packaging Research Center at Georgia Institute of Technology. Dr. Wong spent 19 years at AT&T Bell Labs and was elected as a BellLabs Fellow in 1992. His research interests lie in the fields of polymeric materials, reaction mechanism, IC encapsulation, in particular, hermetic equivalent plastic packaging, electronic packaging processes, interfacial adhesion, PWB, SMT assembly and component reliability. He holds over 45 U.S. patents, numberous international patents and over 350 technical papers in the related area.

Since 1985, Dr. Wong has been teaching polymer materials for electronics packaging and related courses at the IEEE International Electronic Manufacturing Technology Symposium (IEMTS), IEEE Electronic Components and Technology Conference (ECTC) and IEEE Components Packaging and Manufacturing Technology Local Chapter Meetings. Furthermore, he has been invited to give technical seminars and presentations allo over the world. His teaching has beneficially impacted the careers of numerous engineers and scientists worldwide by providing them his insights into the latest polymer materials for electronics packaging and teaching them how to build cost-effective and reliable interconnect systems with polymer materials.

Dr. Wong served as President of the IEEE-CPMT Society in 1992 and 1993. He was elected Fellow of the IEEE in 1992 "for the development and application of silicone polymers used in packaging of electonics." He is currently the CPMT liaison with the ECTC meeting and a Distinguished Lecturer of the Society.

Picture: C. P. Wong trying to predict the future of Packaging Education

(Editor's note: another very active CPMT member, John H. Lau, was a co-winner of this award last year)