Optoelectronics Packaging

MEMS Packaging

Organizer: IEEE CPMT German Chapter

Conference Chair: Dr. Elke Zakel, PacTech GmbH (D)

For complete program, registration forms, and more information: http://www.pactech.de/CPMT-Germany

Sample of Advanced Program

April 22

Invited Speakers:

Lubomir Cergel, Motorola, Switzerland

Horatio Quinones, Asymtek, USA -- "Fluid Jetting for Next Generation packages"

Ken Gilleo, Cookson Electronics, USA

Papers

System in Package Assembly: Required Technology Toolbox, Marcos Carnezos, ChipPac, USA

Thermal Characterization of Flip Chip Connected Devices: Experimental Data and Simulations, Carla Bassani, Alcatel, Italy

New Material Deposition Technologies and Concepts for Advanced Packaging, J. Kloser, EKRA, Germany

From Wafer Bumping to Wafer Level CSP, Elke Zakel, PacTech GmbH, Germany

Application of a Visual Bumped Wafer Inspection System, Ignace Verhamme, ICOS Vision Systems, Belgium

Real 3D Bump Inspection, Matthias Strossner, Siemens AG, Germany

High Accuracy Equipment, Gunther Kurbis, Finetech, Germany

Wafer Level Solder Sphere Printing, J. M. Scheer, Philips CFT DEK, Belgium

Manufacturing Method and Properties of Soft Solder Spheres for BGA packaging, Muriel Graff, OMG AG, Germany

SuperCSP - A Wafer Level Chip Size package Technology, Claudio Truzzi, Convergix, the Netherlands

April 23

Papers

Optoelectronics and Automation for First Level Package Assembly, Richard Boulanger, Universal Instruments, USA

Packaging of Optoelectronic and MEMS Devices with Fluxless Laser Solder Ball Jetting, Thomas Oppert, PacTech GmbH, Germany

Application of AuSn Solder for the Packaging of Optoelectronic Modules, Matthias Hutter, Fraunhofer Institute, Germany

Study of the Electrical Performance of Chip-on-Board Devices, Alla Cordery, Oxford, UK

Single Pass Reflow Encapsulant- New Advanced Material for Flip Chip Assembly, Chad Showalter, Kester Solder

Parameter Study for Solder Joint Reliability of Underfilled Flip Chip Assemblies, Bart Vandervelde, IMEC, Belgium

Residue Life Time Prognostics, H. Hieber, ICR Jena, Germany

The Reliability of Lead-Free Solder Paste in Mechanical Cycling, Kari Maatanen, Pori School of Technology and Economics, Finland

Simulation Tool for Optimizing Heat and Current Allocation in High-Power-Semiconductors..., Frank Sauerland, Fraunhofer Institute, Germany

Flip Chip Applications in Smart Cards, Ghassem Azdasht, Smart Pac GmbH, Germany

Plasma Cleaning for Microelectronic Packaging, Frank Huysmans, March Plasma Systems, USA