IEEE/CPMT Beijing Local Chapter Technical Meeting Report
(December 30, 2001)

A very successful IC electronics packaging technical meeting, organized by the IEEE/CPMT Beijing Local Chapter, was held on December 30, 2001 in the campus of Tsinghua University. At this meeting, Dr. John H. Lau of Agilent Technologies was invited to give a presentation titled: "IC Packaging Trends". There were more than 80 attendees from 11 different units.

At 9:00AM, Professor Ma Jusheng, IEEE/CPMT Beijing Local Chairman, welcomed everybody and introduced some important people at the meeting. Then, Mr. Zhao Guangyun, Secretary General of Electronic Components Society of the Chinese Institute of Electronics, introduced the objectives and organization of IEEE/CPMT. Finally, Mr. Guo Yishu of Ministry of Information Industry introduced the history and functions of IEEE/CPMT. After their brief presentation, many attendees showed their interests in joining the IEEE/CPMT Society.

At 9:40AM, with a very warm welcome, Dr. John H. Lau started his excellent presentation. The contents were very rich and fresh. He talked about IC technology trends, WLCSP (wafer level chip scale package), SOC (system on chip), SOP (system on package), Lead-Free soldering, and Solderless technologies such as adhesives (ICA, ACA, and NCA).

We all enjoyed very much of Dr. Lau's presentation. During the presentation, he liked to ask us questions (to make important points) and wanted us to give him (or to think of) the answers. This presentation-style created very active discussions. He also wanted us to ask him questions and he answered all the questions systematically and clearly. The presentation finished at about 12:20PM with thunderous applause.

This meeting was a great success! It is not only because of Dr. Lau's exceptional presentation, but more than half of the attendees are young people. This reflects a great future of Chinese IC packaging technologies. At the same time, this meeting introduced the IEEE/CPMT Society to the Chinese people who are working in IC packaging areas.

Professor Ma Jusheng
IEEE/CPMT Beijing Local Chapter Chair
December 31, 2001