Announcement
3rd International Conference
on
Thermal
and Mechanical Simulation in (micro-) Electronics
EUROSIME 2002
www.eurosime.com
April 14 – 17,
2002
Paris, France
EuroSimE 2002 will address the results of both fundamental
research and industrial application for thermal and mechanical
solutions of (micro)-electronics, focussing on advanced simulation
and experiments technologies. The aims of this conference are
to
- Promote further development and application of advanced simulation
methodology and experiment technology for electronic industry
- Disseminate competence and results obtained from relevant
research projects
- Promote the integration and co-operation of competencies
at international level
- Strengthen communication and co-operation between industry,
universities, and research institutes
Courses (Sunday April 14th 2002):
- Practical Application of Computational
Fluids Dynamics (CFD) Analysis to the Prediction of Board-Mounted
Electronics Heat Transfer
Peter Rodgers, Ph.D. , Electronics Thermal Management, Ltd.
- Thermomechanical Reliability of Microelectronic
Packaging
Jianmin Qu, Ph.D., Professor in Mechanical Engineering at Georgia
Institute
- Thermo-mechanical durability of lead free
solders
Abhijit Dasgupta,Professor, Mechanical Engineering, University
of Maryland
- State-of-the-art and trends in advanced
packaging
Rolf Aschenbrenner, Fraunhofer Institut für Zuverlässigkeit
und Mikrointegration, Berlin, Germany
Advance conference program (April 15-17, 2002):
- Session 1 : Trends in microelectronics
- Session 2 : The state of the art in thermo-mechanical
solutions for microelectronics
- Session 3 : Virtual prototyping
- Session 4 : Reliability of solder interconnections
- Session 5 : Thermal design and modeling
- Session 6 : Education
- Session 7 : New modeling methodologies
- Session 8 : Application and development of
thermal modeling
- Session 9 : Interface strength
- Session 10 : Thermal performance modeling
and simulation
- Exhibitors special session
- Session 11 : Materials characterization and
modeling
- Session 12 : Modeling for new technologies
- Session 13 : Process and reliability modeling
- Session 14 : Design for reliability
More information:
http://www.eurosime.com/,
compete@mta.fr, tel.: +33 1 4451 7400