Forthcoming CPMT Conferences - VP Jim Morris

2002

Wafer Level Packaging Workshop
Atlanta GA March 1-3, 2002
Contact: wlp@ee.gatech.edu www.prc.gatech.edu

8th International Symposium on Advanced Packaging Materials
Atlanta GA March 3-6, 2002
Contact Rajen Chanchani chanchr@sandia.gov
Jianmin Qu jianmin.qu@me.gatech.edu 404-894-5687

Semiconductor Thermal Measurement & Management Symposium
San Jose CA March 12-14, 2002
Contact: Bonnie Leigh Crystall cscomm@earthlink.com
(520)323-2870 fax: (520)323-2863
http://thermengr.com

Academic Packaging Conference
Dresden, Germany 19-22 March
Contact: Klaus Wolter wolter@iet.et.tu-dresden.de
Thomas Zerna academic2002@iet.et.tu-dresden.de
www.iet.et.tu-dresden.de/education2002/index.html

22nd Capacitor & Resistor Technology Symposium (CARTS 2002)
New Orleans 25-29 March 2002
Contact: CARTS 1-256-536-1304 fax: 1-256-539-8477 www.cti-us.com

EuroSimE 2002
Paris, France 15-17 April 2002
Contact: Olivier de Saint Leger Compete@mta.fr
+33-1-44517400 fax: +33-1-44517401
Bart Vandevelde vandevel@imec.be
+32-16-281-513 fax: +32-16-281-501
www.eurosime.com


Tutorial on Flip Chip and Chip Scale Package
in Munich during Semicon Europe
April, 15 - 16, 2002
Organizer: PacTech GmbH

4th International Workshop on Area Array Packaging Technologies
in Berlin, after Semicon Europe
April, 22 - 23, 2002
Organizer: IEEE CPMT - German Chapter

2002 International Conference on Electronics Packaging (ICEP)
Tokyo, Japan 17-19 April, 2002
Contact: 2002 ICEP Secretariat imaps-j@jiep.jp
http://www.jiep.or.jp/index.html

Symposium on Design, Test, Integration & Packaging (DITP 2002) of MEMS/MOEMS
Cannes-Mandelieu, France 5-8 May 2002
Contact: http://tima.imag.fr/news/orga_conf.asp (second page)

6th IEEE Workshop on Signal Propagation on Interconnects (SPI)
May 2002
Contact: Flavio Canavero +39-011-564-4060 fax: +39-011-564-4099 canavero@polito.it
Ivan Maio +39-011-564-4100 fax: +39-011-564-4099 maio@polito.it
www.tet.uni-hannover.de/SPI

25th International Spring Seminar on Electronics Technology (ISSE'02)
Prague, Czech Republic 11-14 May, 2002
Contact: Pavel Mach mach@feld.cvut.cz

CPMT TC-14 System Packaging Workshop
Research Triangle Park, May 14-16, 2002
Contact: Dan Amey email: Daniel.I.Amey@usa.dupont.com

52nd Electronic Component & Technology Conference
San Diego CA May 28-31, 2002
Contact: www.ectc.net

8th Intersoc. Confer. Thermal & Themomechanical Phenomena
in Electronic Syst's (I-THERM)
San Diego, CA May 29 - June 1, 2002
Contact: Paul Baltes; epd@engr.arizona.edu
Univ. of Arizona; Engrg. Prof. Development;1224 N. Vine Ave.; Tucson, AZ 85719-4552
Tel: +1 520 621 5104; fax: +1 520 621 1443

2002 Intensive Course on Electrical Contacts
June 10-13, 2002 at Omni Shoreham Hotel, Washington, D.C.
www.ewh.ieee.org/soc/cpmt/tc1/

POLYTRONIC 2002
2nd International IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics
Zalaegerszeg, Hungary June 23-26, 2002
Contact: Peter Bojta bojta@ett.bme.hu
www.ett.bme.hu/polytronic2002

4th International Symposium High Density Packaging
& Component Failure Analysis (HDP´02)
Equatorial Hotel, Shanghai,China June 30-July 3, 2002
Contact: Tiebing Wang tiebing@pe.chalmers.se
Xiaomin Xie xmxie@itsvr.sim.ac.cn

48th IEEE Holm Conference on Electrical Contacts
Oct 21-23, 2002 Holiday Inn International Drive, Orlando Florida.
www.ewh.ieee.org/soc/cpmt/tc1/
 
Tutorial on Flip Chip and Chip Scale Package
in Munich during Electronica
November, 11 - 12, 2002
Organizer: PacTech GmbH
 
4th International Workshop on Area Array Packaging Technologies
in Berlin, after Electronica.
November, 18 - 19, 2002
Organizer: IEEE CPMT - German Chapter

4th International Workshop on Smart Card Technologies & Applications
Germany November 18-20
Contact: elke.zakel@ieee.org 49-(0)-30-467-815-55/fax 49-(0)-30-467-815-51
www.pactech.de/CPMT-Germany

4th Electronics Packaging Technology Conference (EPTC'2002)
Singapore December, 2002
Contact: Jasmine Leong ept@pacific.net.sg
Charles Lee Charles.Lee@infineon.com
http://cicfar.ee.nus.sg/eptc.html