Upcoming German CPMT Activities

1. April, 15 - 16, 2002
Tutorial on Flip Chip and Chip Scale Package
in Munich during Semicon Europe
Organizer: PacTech GmbH

2. April, 22 - 23, 2002
4th International Workshop on Area Array Packaging Technologies
in Berlin, after Semicon Europe
Organizer: IEEE CPMT - German Chapter

http://www.pactech.de/docs/AAWS2002.pdf

3. November, 11 - 12, 2002
Tutorial on Flip Chip and Chip Scale Package
in Munich during Electronica

Organizer: PacTech GmbH

 

4. November, 18 - 19, 2002
4th International Workshop on Area Array Packaging Technologies
in Berlin, after Electronica.

Organizer: IEEE CPMT - German Chapter

- - Submitted by Dr. Elke Zakel, zakel@pactech.de