Jointly Organized by
DaimlerChrysler SIM Technology and
Chalmers University of Technology, Sweden

In Cooperation with IEEE-CPMT Society, USA Society
IEEE CPMT Sweden Chapter
Shanghai Institute of Microsystems and Information Technology

Announcement and Call for Papers
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02)

Date: June 30 - July 3, 2002

Venue: Galaxy Hotel

Co-sponsored and jointly organized by

DaimlerChrysler SIM Technology, Shanghai, China.

&

Division of Electronics Production, Chalmers University of Technology, Gothenburg, Sweden

Technical co-sponsorship with
IEEE CPMT Society
IEEE CPMT Sweden Chapter
Shanghai Institute of Microsystems and Information Technology, China

Electronics manufacturing, assembly and packaging technology is playing a key role for the progress of the microelectronics industry in the world. China is not an exception. Therefore, many multi-national companies are establishing new facilities in China for expanding their global business and interest. Following the successful previous conferences, we are proud to announce the Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02).

Scope for the Symposium: The Symposium will cover the following areas and subjects:

· High density packaging including electronics and opto-electronics packaging, CSP, BGA, Flip-chip, Chip on Board, Surface Mount Technology and other novel emerging technology
· High density substrate including integrated passives and active devices
· MEMS design, packaging and assembly
· Electronics manufacturing issues including cleaning issues, quality control, logistics, repair, process optimization, statistic process controls, ISO compliance, tooling or equipment, early manufacturing involvement initiatives and yield and test innovations used to enhance manufacturing processes or products related to high density substrates, single chip and multichip packaging, chip bumping and integrated component technologies
· Component failure analysis techniques including non-destructive X-ray, ultrasonic microscopy, IR-microscopy etc
· Simulation and modelling for packaging and electronics manufacturing processes
· Thermal management
· Environmental design and materials development including life cycle analysis and end of life strategy etc
· Cost reengineering, improvements and analysis for electronics packaging processes and products

Documentation: The documentation from the Symposium will be published in a proceeding with CD ROM with a full length papers (max 12 A4 pages) in English.

Journal publication: In addition, high quality papers will be selected for consideration to be published as special editions of the IEEE CPMT Transactions, "Soldering and Surface Mount Technology" or Journal of Electronics Manufacturing

Languages: English will be used. Simultaneous translation into Chinese is made to suit the Chinese delegates.

Symposium Chair: Xiaoming Xie, DaimlerChrysler SIM Technology Co., Ltd, China.

Symposium Co-chair: Johan Liu, Chalmers University of Technology, Sweden.

International Advisory Committee

C P Wong, Georgia Institute of Technology, USA, Chair
Rolf Aschenbrenner, IZM, Germany
Heiner Bayer, Siemens, Germany
Arun Chaudhuri, Delco Delphi Electronics Systems, USA
Jannick Guinet, Schneider Electric, France
Joakim Anjeby, Saab Ericsson Space, Sweden
Jannes Jagt, Philips, The Netherlands
Jorma Kivilahti, Helsinki University of Technology, Finland
Kåre Gustavsson, Ericsson Radio Systems, Sweden
Pontus Lundström, Ericsson Microelectronics, Sweden
Wei Koh, Kingston, USA
John Lau, Agilent Technologies, USA
Luo Le, Shanghai Institute of Microsystems and Information Technology, China
Y C Lee, University of Colorado, USA
Sheng Liu, Wayne State University, USA
Jusheng Ma, TsingHua University, Beijing, China
Erdogan Madenci, University of Arizona, USA
Bernd Michel, IZM, Germany
James Morris, State University of New York, Binghamton, USA
Koji Nihei, Waseda University, Japan
K W Paik, Korean Advance Institute of Science and Technology, Korea
Yi-Hsin Pao, Ford, USA
Robert Pfahl, Motorola, USA
W J Plumbrige, Open University, UK
Patrice Rollet, Promosol, France
Petri Savolainen, Nokia, Japan
Frank Stubhan, DaimlerChrysler SIM Technology Co., Ltd, China
Ganesh Subarayan, University of Colorado, USA
K. Suganuma, Osaka University, Japan
Ephraim Suhir, Lucent Technologies, USA
Kenichi Suzuki, Japan
Osamu Takeda, T & T Ltd, Japan
Andrew Tay, National University of Singapore, Singapore
Rao Tummala, Georgia Institute of Technology, USA
Yuelin Wang, Shanghai Institute of Microsystems and Information Technology, China
Itsuo Watanabe, Hitachi Chemicals, Japan
David Whalley, Loughborough University, UK
Kin Wong, Semiconductor Equipment and Materials International, USA
Jianming Qu, Georgia Institute of Technology, USA
Anders Thölén, Chalmers University of Technology, Sweden
Liqiang Xu, , DaimlerChrysler SIM Technology Co., Ltd., China
Shouwen Yu, Tsing Hua University, Beijing, China

Magnus Willander, Chalmers University of Technology, Sweden
Xiangfu Zong, Fudan University, China

Program committee

Xiaoming Xie, Chair, DaimlerChrysler SIM Technology, China.

Guo Liang Chen, University of Science & Technology, Beijing, China
Liu Chen, Chalmers University of Technology
Yi Lan Kang, Tianjing University, Tianjing, China
Charles Lee, Infineon, Singapore
Helge Kristiansen, SINTEF, Norway
Xitao Wang, Chalmers University of Technology, Sweden
Piotr Starski, Chalmers University of Technology, Sweden
Arne Tolvgård, Ericsson Radio Systems, Sweden
Yan Li Wang, University of Science & Technology, Beijing, China

You are welcome to submit an abstract with max 300 words that cover the topic, experimental approach, results and conclusions for the paper by March 25, 2002 to Dr. Xiaoming Xie at xiaoming.xie@daimlerchrysler.com. Notification of abstracts will be made by April 5, 2002, Final paper is requested by April 30, 2002.

We are also interested to have exhibitors from materials, equipment suppliers to exhibit their products. If you are interested in exhibition, please also contact Dr.Xiaoming Xie at DaimlerChrysler SIM Technology Co., Ltd.

Contact Information Form

I am interested to join the HDP´02. I would like to receive further information on the Symposium ________________ (Please mark here).

We are interested to make an exhibition _________________(Please mark here).

Registration information:

Name: ______________________ Title:_________________________

Organisation:________________

Address:_______________________ P O Box: __________________

Area Code:_____________ State: _____________ City:__________ Country:___________

Tel: ________________, Fax_______________, Email:____________________

I would like to submit a paper. The title of the paper is:

______________________________________________________________________

Please fax this sheet together with the abstract of the paper to Dr. Xiaoming Xie at Xiaoming.xie@Daimlerchrysler.com . You may also contact Marie Ericsson at Chalmers University of Technology, Division of Electronics Production, email: marie.ericsson@ivf.se, tel:+46-31-706 6287 or fax:+46-31-706 6289.