International Conference on Electronics Packaging

April 17

WA1:High Speed / High Frequency  Packaging
Chairperson: R. Tummala (Georgia Institute of Technology), O. Ibaragi (ASET)
"Directions in RF Module Packaging" (Session Invite), S.-K. Chiang, Prismark Partners / U.S.A.

 WB1: Pb-free Solders
Chairperson: M. Otsuka (Shibaura Institute of Technology), H. Sawai (Oki Electric Industry)
"JIEP Low Temperature Soldering Project" (Session Invite)K. Suganuma, Osaka University / Japan

Invited Speech
Chairperson: S. Denda (Nagano Prefectural Institute of Technology), K.Hashimoto (Fujitsu Laboratories)
"Device Packaging in the Year 2020", Dr. C. E. Bauer, TechLead Corporation / U.S.A.
Asia Session

April 18
TA1: Advanced Packaging
Chairperson: C. E. Bauer (TechLead), M. Tsukamoto (Matsushita Electric Industrial)
"Recent Advances in Integral Passives Research at Georgia Tech" (Session Invite), R. R. Tummala, S. Bhattacharya, S. Dalmia, P. M. Raj, T. Ogawa, S. H. Lee, R. Mani, A. Bavisi, F. Ayazi, Georgia Institute of Technology / U.S.A.
The Growth of the Flip Chip Market: New Applications and Developments (Session Invite), E. J. Vardaman, TechSearch  International / U.S.A.

TB1: Plating
Chairperson: E. Zakel (Pac Tech), A. Okuno (Sanyu Rec)

TA2: Optoelectronics
Chairperson: S.-K. Chiang (Prismark Partners), Y. Ando (Fujikura)
TB2: Materials
Chairperson: Z. Kachwalla (CSIRO), I. Kaneko (Musashi Institute of Technology)
TA3: Interconnection I
Chairperson: J. Maattanen (Elecoteq Network), H. Matsubara (Sharp)
"High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging "(Session Invite), E. Zakel, L. Titerle, T. Oppert, R. Blankenhorn, Pac Tech / Germany, U.S.A.
TB3:Simulation
Chairperson: H. Nishida (International Display Technology) E. Takagi (Toshiba)
"Study of Beyond GHz Signal Integrity Under TEM Wave Mode Analysis in Multi-channel Transmission Lines" (Session Invite), K. Otsuka, C. Ueda, Meisei University, Y. Odate, T. Usami, University of Tokyo / Japan

April 19

FA1: 3D Packaging
Chairperson: M.-K. Iyer (Institute of microelectronics), S. Uegaki (Kyocera)
FB1: Interconnection II
Chairperson: Y.-B. Sun (Kyonggi University), I. Watanabe (Hitachi Chemical)
"New Concepts in Flipchip Bump Technology" (Session Invite), S. Denda, Nagano Prefectural Institute of Technology / Japan
FA2: Design and Testing
Chairperson: S.-L. Fu (I-Shou University), S. Oka (Mitsubishi Electric)
FB2: Thermal Management
Chairperson: C. Zardini (University Bordeaux I), S. Kitajo (NEC)
FA3: Substrates
Chairperson: H. Quinones (Asymtek), H. Hozoji (Hitachi)
FB3: Reliability
Chairperson: F. Uchikoba (TDK), T. Kobayashi (Tohoku Epson)