Power Electronics Packaging committee Meets at APEC

The Power Electronics Packaging Committee met on 12 March during the IEEE Applied Power Electronics Conference (APEC) and discussed future initiatives. At the present the committee supports solicitation of papers for the major society conferences and initiates a workshop every other year. The meeting focused on initiating the next International Workshop on Integrated Packaging in 2003. Both the Power Electronics Society (PELS) and Components, Packaging and Manufacturing Technology Society (CPMT) were financial sponsors of the previous two workshops and expressed support for the third.

A second discussion focused on committee direction and meeting the future needs of those involved in packaging. Power electronics packaging has evolved as a commonly recognized concurrent part of power electronics design, and both the electrical and packaging designers have equal interest. The committee will split its strategies and have distinct foci on technology and applications. This is envisioned as closer affiliation between PELS and PSMA (Power Sources Manufacturers Association) to meet the needs of electrical design engineers.

The committee is greatly interested in new members. Due to shifts within companies, committee membership has varied substantially. If you are interested in being an active committee contributor or just an observer (an 'activist in waiting'), please contact Dr. Hopkins at D.Hopkins@IEEE.Org and make your preference known.