Awards to CPMT Members at ECTC
(Pictures thanks to Kristine Martin, Potomac Communications Group)
On May 30th the annual CPMT Luncheon was held during the ECTC
conference. About 900 engineers attended. This occasion was used
to give volunteers some well-deserved awards and recognition.
President Rao Tummala presented Mr. Skipor The Special Presidential
Recognition Plaque awarded to Robert W. Galvan "for sustained
support to the CPMT Society and the Electronic Components and
Technology Conference, for establishing the Motorola/IEEE CPMT
Society Graduate Fellowship for Research on Electronic Packaging,
and for promoting graduate-level education."
Vice President Paul Wesling is giving Suresh Sitaraman of Georgia
Tech the Best Paper Award for the Transactions paper "Interfacial
Fracture Toughness for Delamination Growth Prediction in a Novel
Peripheral Array Package."
Outstanding Sustained Technical Contribution Award was
earned by Prof. Avram Bar-Cohen of University of Maryland. His
contributions to thermal design, modeling and analysis including
ebullient and liquid-phase cooling.
Li Li of Motorola won the Outstanding Young Engineer Award
for her contributions to flip chip interconnect bumping materials
and process development and embedded passive design and implementation
in radio frequency modules.
Prof. C. P. Wong of Georgia Tech deserved the Exceptional Technical
Achievement Award for his pioneering work in polymeric materials
for electronics packaging applications and for his introduction
and development of silicon gels to achieve reliability without
hermeticity.
The David Feldman Outstanding Contribution Award was given
in recognition of the technical leadership and outstanding contributions
to the microelectronics packaging industry by Professor Herbert
Reichl .