UPCOMING CONFERENCES

2002

**POLYTRONIC 2002 (2nd International IEEE Conference on Polymers & Adhesives in Microelectonics and Photonics), Zalaegerszeg, Hungary, June 23-26, 2002 --- polytroni2002@ett.bme.hu, fax: +36-1-463-4118

**4th International Symposium of High Density Packaging & component Failure Analysis (HDP-02), Shanghai, China, Galaxy Hotel, June 30 - July3, 2002, johan.liu@pe.chalmers.se or xmxie@itsvr.sim.ac.cn

**International Electronics Manufacturing Technology Symposium (IEMT) with Semicon, San Jose CA, 17-18 July 2002, Glorie Lou at glou@semi.org, fax 1 408 943 7913.

**9th Annual International KGD Packaging and Test workshop, September 8 - 11, 2202, Mapa California, www.dieproduct.com

**2002 Workshop on Accelerated Stress Testing (AST 2002), Montreal, Canada, 2 - 4 October, 2002, Kirk Gray, k.a.gray@ieee.org.

**2002 IEEE Holm Conference on Electrical Contacts, Orlando FL, October 21 - 23, 2002, Jeanette Lopez, j.m.lopez@ieee.org, fax 1 732 981 1203

**Future Directions in IC & Package Design Workshop (FDIP), Monterey CA, 19 October 2002, www.epep.org, fax 1 520 621 1443

**11th Topical Meeting on Electrical Performance & Packaging (EPEP 2002), Monterey CA, 21 - 23 October 2002, www.epep.org, fax 1 520 621 1443

**6th VLSI Packaging Workshop of Japan, Kyoto, Japan, November 12 - 14, 2002, nakamura-atsushi4@sic.hitachi.co.jp, fax +81 42 327 8631

**4th International Conference on Electronics Materials & Applications, Germany, November 18 - 20, 2002, elke.zakel@ieee.org

**4th International Conference on Electronics Materials & Packaging (EMAP), Kiaohsiung, Taiwan, December 4 - 6, 2002, Shen-Li Fu, szyi@isu.edu.tw, fax 886 7 6577051

**Electrical Design of Advanced Packaging Systems (EDAPS), Singapore, 9 December 2002, Karen Chin, karen@ime.org.sg, fax 65 6774 5747

**4th Electronics Packaging Technology Conference (EPTC'2002), Singapore, December 11 - 13, 2002, Charles.Lee@infineon.com, eptc_ieee@pacific.net.sg

2003
**Commercialization of Military and Space Electronics, Feb 10--13, 2003, Los Angeles CA, dal@cti-us.com

**9th International Symposium on Advanced Packaging Materials, March 19-21, 2003, Atlanta, Georgia

**53rd Electronic Component and Electronics Technology, May 27 = 30, 2003, New Orleans, Louisianna.