Nano Packaging Georgia Tech & Singapore

Rao Tummala, Pettit Chair Professor and Director of the Georgia Tech Packaging Research Center and President of the IEEE CPMT Society, will lead an international collaboration between Georgia Tech, The National University of Singapore and The Institute of Microelectronics of Singapore in a 3-year $3M program to explore and develop Nano wafer level packaging technologies through a substantial research and education initiative. The program was awarded through Singapore's distinguished Temasek Professorship and provides the funding to develop the extensive research and education program in Nano technologies. The program's central objective will be to explore and demonstrate cost-effective ultra-fine pitch Nano wafer level packaging interconnections to meet the needs of Nano chips, which are expected to be in production within two years. Professor Tummala will lead a team of 20 faculty and researchers and 30 graduate students at Georgia Tech and in Singapore.