HDP´02 Conference in Shanghai, China

(editor: this meeting is happening as we go to press)

For further information on proceedings or information on what happened at this meeting, please contact

Mrs Marie Ericsson at marie.ericsson@ivf.se

or Prof Xiaomin Xie at Xiaoming.Xie@daimlerchrysler.com

Or visit webpage at http://www.pe.chalmers.se/org/elprod/conf/home.html

The Fourth International IEEE Symposium on High Density Packaging and
Component Failure Analysis in Electronics Manufacturing (HDP´02)

Date: June 30 - July 3, 2002

Venue: Galaxy Hotel

Co-sponsored and jointly organized by

DaimlerChrysler SIM Technology, Shanghai, China.

&

Division of Electronics Production, Chalmers University of Technology,
Gothenburg, Sweden

Technical co-sponsorship with
IEEE CPMT Beijing Chapter
IEEE CPMT Society
IEEE CPMT Sweden Chapter
Shanghai Institute of Microsystems and Information Technology, China

Ricky Lee: University of Science and Technology, Hong Kong, BGA, CSP
and HDI substrate technology

John Pang: Nanyang University of Technology, Singapore, solder joint
reliability

Johan Liu: Chalmers University of Technology, Sweden, lead-free solders

Goran Wetter: IVF, Sweden, Failure analysis on packaging components and
PCB materials

David Shao: Ericsson AB, Sweden, Cooling of Electronics

submitted by:
Johan Liu
Professor in Electronics Production
Head of Division of Electronics Production
School of Mechanical and Vehicular Engineering
Chalmers University of Technology
C/O IVF
Argongatan 30
Se - 431 53 Mölndal
Sweden
Email: johan.liu@me.chalmers.se
telephone: +46-31-706 6294 (IVF office); +46-31-772 3821(Chalmers office)
fax:+46-31-7066289
http://www.pe.chalmers.se/org/elprod