9th International
Symposium and Exhibition on Advanced Packaging
Materials, Processes, Properties
and Interfaces.
March 19 -
21, 2003
Atlanta, Georgia
USA
Who should
attend? attendees of this symposium in the past have been comprised
of researchers, developers, producers and users of materials for
single and multichip packages, interconnections, substrates, microwave
applications, optoelectronic packages and display panels.
Call for Papers
Abstracts
If you
are interested in presenting a paper at this symposium, please
send an abstract (~300 words) to Dr. Petri Savolainen via e-mail
at petri.jo.savolainen@nokia.com . Pleas include your affiliation,
mailing address, phone number and e-mail address in your submission.
the deadline to receive the abstract is October 10, 2002.
Important Dates
- 10 October 2002
----Submission of abstract
- 10 December
2002 --Notification of acceptance
- 15 January 2003
-----Submission of manuscript
Technical Sessions
(Session Chairs)
- MEMS and Thin
Films (Phil Garrou and Katarina Boustedt)
- Adhesives (Jim
Morris and Johan Liu)
- Underfills (Quinn
Tong and CP Wong)
- Encapsulants
and Coatings (Ray Pearson and Dan Baldwin)
- Bumping Materials
and Processing (Rolf Aschenbrenner and Dan Scheck)
- Solders (Ricky
Lee and Rajen Chanchani)
- Substrates,
HDI and Dielectrics (Petri Savolainen and Mark Maline)
- Manufacturing
and Reliability (Andreas Schubert and Suresh Sitaraman)
- Passive Materials
(Larry Mann and George White)
- Nano Materials,
Optical and RF materials (Rao Tummala, Phil Garrou and Jim Morris)
- Posters (Jianmin
Qu and CP Wong)
For More Information
- Dr. Petri Savolainen,
Technical Chair
- Nokia
- Itamerenkatu
11-13
- Helsinki, 00180,
Finland
- Phone: +358
7180 39382
- Fax: +358 7180
37143
- email: petri.jo.savolainen@nokia.com
or
- Melissa Sherrer
- Georgia Tech
PRC (M/C 0250)
- 813 Ferst Drive,
Room 351
- Atlanta, Georgia
30332-0560 USA
- Fax: +1 404
894 9097
- email: msherrer@ee.gatech.edu
-