President's Message

Another Success

By Rao Tummala, CPMT President

The IEEE-ECTC Conference Was Highly Successful Most conferences around the world are having low to poor attendance, but not ECTC - - IEEE-CPMT's premier conference which was held in San Diego, May 28-31, 2002. This year's conference was attended by over 1000 scientists, engineers, managers, faculty and students from 30 countries. The attendance marked a 9% increase over last year. In addition, the conference offered 290 technical papers, 14 short courses on topics ranging from today's IC and systems packaging to emerging SIP, SOP and wafer level packaging technologies. The technology booths have increased to 67 and about 45% of the papers came from outside the U.S. For the first time, there were more attendees from the academic community than from industry. The panel discussion arranged by the local San Diego CPMT chapter, as well as the plenary session, were highly successful. These are fantastic statistics for this economy. My sincere thanks to Mike McShane, the General Chair of ECTC, and his organizing committee.

 

 

Congratulations to 6 New IEEE Fellows
Six new Fellows were elected from the CPMT membership this year, some received the honor at ECTC. As we all know, IEEE Fellow is the highest honor one can receive for technology or leadership contributions and only a small fraction, typically 0.1% of IEEE members, receive such a distinction.
· Cristina H. Amon (Carnegie Mellon University, USA) - For contributions to thermal management techniques for wearable computers and portable electronics.
· Paul Siu-Chung Ho (University of Texas at Austin, USA) - For contributions to metalization of, and metrology for, multilevel interconnects and electronic packages. (continued on page 3)

CPMT President Rao Tummala
· Osami Ishida (Mitsubishi Electric Corporation, Japan) - For leadership in research and development of microwave devices for mobile communications.
· George Alexander Katopis (IBM, USA) - For contributions to the advancement of switching noise estimation and containment in first-level packaging structures and architecting of design approaches.
· Ravindhar K. Kaw (Agilent Technologies, USA) - For contributions to the development of parametrics, tools and methodologies for the electrical design of electronic packaging.
· Tseung-Yuen Tseng (National Chiao Tung University, Taiwan) - For contributions to ceramic capacitor and sensor technology.

Congratulations to Society Winners
As in the past, the Society has recognized its major contributors in technology, in service and in Education (see March Newsletter).
· The David Feldman Outstanding Contribution Award
Herbert Reichl (Fraunhofer IZM, Germany) - For his technical leadership and outstanding contributions to the microelectronics packaging industry.
· Outstanding Sustained Technical Contribution Award
Avram Bar-Cohen (University of Maryland, USA) - For his contributions to thermal design, modeling and analysis and for original research on ebullient and liquid-phase cooling.
· Exceptional Technical Achievement Award
C.P. Wong (Georgia Institute of Technology, USA) - For his pioneering work in polymeric materials for electronics packaging applications and for the introduction and development of silicon gels to achieve reliability without hermeticity in plastic integrated circuits (IC) packaging.
· Outstanding Young Engineer Award - Co-winner
Li Li (Motorola, Inc., USA) - For her contributions to flip chip interconnect bumping materials and process development and embedded passive design and implementation in radio frequency (RF) modules.
· Outstanding Young Engineer Award - Co-winner
Christine Kallmayer (Fraunhofer IZM, Germany) - For her contributions to various packaging technologies including Gold-Tin (AU-Sn) solder interconnections and flex-based packages, and for her active participation 8in CPMT Society-sponsored technical conferences.
Special Presidential award to Bob Galvin,
Chairman - Emeritus of Motorola
The CPMT Society was pleased to honor Bob Galvin, formerly of Motorola, for his sustained support of CPMT and ECTC by establishing the "Motorola Graduate Fellowship for Research and Education in Microelectronic Packaging."

Society Continues on its Strategic Initiatives
Our Society continues to make progress on all its strategic initiatives, and the marketing of our Society is in full swing. We have met with several magazine editors to convey our message: Advanced Packaging, Spectrum, and EE times. We have also begun to focus on Leadership Development in Europe and Asia. The Asian development workshop is slated for December and the European for next year. Rolf Aschenbrenner of IZM, Berlin has been named the Strategic Director for CPMT European Operations and Bill Chen of ASE, Taiwan for Asian Operations.
CPMT Welcomes Three New TC Chairs
· Michael Topper of IZM, TC -18, wafer level Packaging
· Yoshitaka Fukuoka , Japan, TC-6. High Density Packaging
· Michelle Berry of Intel, TC-3, IC assembly