TC-5/ Materials at ECTC

Chair Rajen Chanchani called together TC-5 at a morning meeting on Thursday May 30, 2002 during the ECTC in San Diego. Also trying to wake up were C. C. Lee the Vice-Chair from U. C. Irvine, Sridhar Canumalla the Web Master from Sonoscan, Richard Benson of Johns Hopkin, Eric Perfecto from IBM, Charles Lee from Infineon-Singapore, Kyung W. Paik of KAIST, Jim Morris from Prtland State, Vaidyanathan Kripesh of IME-Singapore, and John Pang from Nanyang Technical University-Singapore.
Old Activities Status
** TC-5 sponsored the recent Packaging Materials Symposium held near Atlanta. The conference is now sponsored jointly by IEEE-CPMT (TC-5) and Georgia Tech Packaging Research Center (PRC).
** Rajen announced that C. C. Lee is the Vice-Chair and Sridhar Canumalla is the TC-5 Web Master. Send all your updates to Sridhar.

There was a discussion on sponsorship of conferences. TC-5 sponsors directly four conferences: Atlanta Packaging Materials Conference, Polytronic Conference in Europe, Component Failure Analysis (HDP) in Shanghai, and Electronic Materials and Packaging (EMAP) moving in Asia. The EPTC Conference to be held in Singapore this year in December is a general meeting and will be jointly sponsored by all TCs. There are several business issues relating to conference sponsorship which the Board of Governors must address, but the TC job is to present the best technical program possible.
Eric Perfecto proposed that TC-5 sponsor an ongoing "Polymer in Electronics" conference held every year in upstate NY. This conference is currently sponsored by the local chapter of the Society of Plastic Engineers. Eric will provide detailed information in the coming months so that we can bring up the issue to the Board of CPMT during the November meeting.
Become a volunteer if you have material interests. Contact Rajen at: r.chanchani@ieee.org.