CPMT Conference Schedule

2002

**9th Annual International KGD Packaging and Test workshop, September 8 - 11, 2002, Napa California, www.dieproduct.com

**2002 Workshop on Accelerated Stress Testing (AST 2002), Montreal, Canada, 2 - 4 October, 2002, Kirk Gray, k.a.gray@ieee.org.

**2002 IEEE Holm Conference on Electrical Contacts, Orlando FL, October 21 - 23, 2002, Jeanette Lopez, j.m.lopez@ieee.org, fax 1 732 981 1203

**Future Directions in IC & Package Design Workshop (FDIP), Monterey CA, 19 October 2002, www.epep.org, epd@engr.arizona.edu, fax 1 520 621 1443

**11th Topical Meeting on Electrical Performance & Packaging (EPEP 2002), Monterey CA, 21 - 23 October 2002, www.epep.org, epd@engr.arizona.edu, fax 1 520 621 1443

**Electronics Packaging Symposium -- Optoelectronics, October 21 - 23, 2002, www.wtsn.binghamton.edu/coned, State University of New York - Binghamton

**Flip Chip Tutorial before Electronica, Munich Germany, contact PacTEch GmbH

**6th VLSI Packaging Workshop of Japan, Kyoto, Japan, November 12 - 14, 2002, nakamura-atsushi4@sic.hitachi.co.jp, fax +81 42 327 8631

**4th International Workshop on Smart Card Technologies & Applications, Berlin, Germany, November 18 - 20, 2002, elke.zakel@ieee.org

**4th International Conference on Electronics Materials & Applications, Germany, November 18 - 20, 2002, elke.zakel@ieee.org

**4th International Conference on Electronics Materials & Packaging (EMAP), Kiaohsiung, Taiwan, December 4 - 6, 2002, Shen-Li Fu, szyi@isu.edu.tw, fax 886 7 6577051

**Electrical Design of Advanced Packaging Systems (EDAPS), Singapore, 9 December 2002, Karen Chin, karen@ime.org.sg, fax 65 6774 5747

**4th Electronics Packaging Technology Conference (EPTC'2002), Singapore, December 11 - 13, 2002, Charles.Lee@infineon.com, eptc_ieee@pacific.net.sg

2003
**International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong & Shenzhen, January 13 - 14, 2003, Angie Wong wywong@ee.cityu.edu.hk, fax 852 2788-7579

**2003 IEEE/CPMT 19th Semiconductor Thermal Measurement & Management Symposium, San Jose, March 11 - 13, 2003, Bonnie Crystall, cscomm@earthlink.net, fax 1 480 345 1119

**8th European Workshop of the Systems Packaging Committee, Cork Ireland, January 20-23, 2003, http://www.ewh.ieee.org/soc/cpmt/tc14/.

**Commercialization of Military and Space Electronics, Feb 10--13, 2003, Los Angeles CA, dal@cti-us.com

**9th International Symposium & Exhibition on Advanced Packaging Materials, Atlanta GA, March 19 -21, 2003, petri.jo.savolainen@nokia.com, fax 358 7180 37143

**CARTS 2003, Capacitor and Resistor Technology Symposium, March 29 - April 4, 2003, Scottsdale, Arizona, www.cti-us.com.

**4th Conf on Thermal & Mechanical Simulation & Expts in Microelec & Microsyst (EUROSIME), Aix-en-Provence, France, March 30 - April 2, 2003, compete@mta.fr, fax 33 1 4451 7401

**2003 International Reliability Physics Symposium, Dallas, Texas, March 30 - April 3, 2003, http://www.irps.org

**2003 International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 16 - 18, 2003, imaps-j@jiep.or.jp, fax 81 3 5310 2011

**5th International Conference on Electronics Packaging Technology (ICEPT 2003), Shanghai, China, April 21 - 23, 2003, jjwant@srcap.stc.sh.cn, fax 86 21 65643529

**International Spring Seminar on Electronics Technology, High Tatra, Slovakia, May 8 - 11, 2003, alena.pietrikova@tuke.sk, fax 421 55 6023195

**2003 IEEE 53rd Electronic Component and Electronics Technology, May 27 - 30, 2003, New Orleans, Louisianna., jadams@eia.org, fax 1 703 907 7549

**MST'03 (Microsystems Technologies), Munich Germany, October 7 - 8, 2003, Erik Jung, erju@izm.fhg.de, fax 49 30 46403 161

**3rd Internat IEEE confer on Polymers & Adhesives in Microelectronics & Photonics (Polytronic 2003), Montreux, Switzerland, October 20 - 23, 2003, Bernard Courtois, polytronic2003@imag.fr

-- submitted by Jim Morris, Vice President of Conferences