4th International Symposium on Electronic Materials and Packaging

(EMAP2002)

Call for Papers

You are invited to submit a paper to the 4th international symposium on electronic materials and
packaging 2002 (EMAP2002). The EMAP2002 symposium is organized by the IEEE CPMT Taipei
Chapter and is in collaboration with I-Shou University, IMAPS-Taiwan, and SMTA-Taiwan. The
technical focus is in the field of electronic materials, microelectronics packaging, and assembly
technologies. EMAP 2002 is to promote international technical interchange and provide a forum for
extensive international networking among microelectronics professionals. The symposium will
consist of one-day tutorial sessions, three-day plenary sessions, technical sessions and poster
sessions. Papers are invited from industry participants as well as researchers from the academia and
government organizations.

The topics of interest include but are not limited to the following
subjects:

Advanced Electronic Packaging Technologies: Wafer Level Packaging, Flip Chip, CSP, DCA,
MCM

Packaging Materials and Processes: Lead-free Solders, Adhesives, Underfills, Encapsulants,
PCBs

Interconnect Technologies: Wire bonding, Fine Pitch, Micro via, Build-up Technologies
Materials Characterization, Testing and Measurements: Electrical, Thermal, Chemical,
Mechanical

Thermal Management of Packaging
Package Design, Modeling and Simulation
Sensors and MEMS Packaging
Reliability and Failure Analysis: Interfacial Phenomena, Delamination, Moisture effects
Polymers and Ceramics for Electronic Applications, Thin films/coatings, Metallization
Optoelectronics Packaging

Abstracts and Papers

An electronic form of one-page 300 words abstract with name, address, phone/fax number, and
e-mail address should be submitted to the Secretariat of Symposium,
emap2002@isu.edu.tw by

August 15, 2002. Instructions for preparing the full paper will be sent to the authors whose
abstracts are accepted after review. Accepted papers will be published in a formal IEEE CPMT
Proceeding. Participants will be required to register upon notification of acceptance of their full
papers. Selected best quality papers will be reviewed for the publication at the Transaction of
IEEE-CPMT. Exhibitions will be arranged and the details of registration will be announced later.

Important Dates

August 15, 2002 Abstract submission
August 31, 2002 Abstract acceptance
October 15, 2002 Full manuscript due
October 31, 2002 Registration/hotel accommodation

Correspondence:

Secretariat of EMAP2002
Department of Electronic Engineering, I-Shou University
Kaohsiung County, Taiwan, R.O.C.
Tel: 886-7-6577711
Fax: 886-7-6577051
E-mail: emap2002@isu.edu.tw
Homepage: http://emap2002.isu.edu.tw

Organizing Committee

General Chair:

Shen-Li Fu, I-Shou University, Taiwan.

Secretaries:

Lih-Shan Chen, I-Shou University, Taiwan.
Chi-Shiung Hsi, I-Shou University, Taiwan.
Yu-Jung Huang, I-Shou University, Taiwan.

Members:

Kwang-Lung Lin, National Cheng Kung University, Taiwan.
En-Boa Wu, National Taiwan University, Taiwan.
Bi-Shiou Chiou, National Chiao Tung University, Taiwan.
Chemg-Heng Kao, National Central University, Taiwan.
Jong-Ning Aoh, National Chung Cheng University, Taiwan
Charles Lin, Bridge Semiconductor Corp., Taiwan.
Gray Huang, International Semiconductor Technology Ltd., Taiwan.

International Advisory Board

Charles E. Bauer, USA
Jang-Kyo Kim, Hong Kong
Ricky Lee, Hong Kong
Kyung-Wook Paik, Korea
Soon-Bok Lee, Korea
Zhaonian Cheng, China
Jusheng Ma, China
C. P. Wong, USA
Michael Pecht, USA
Alessandro Gandelli, Italy
Johan Liu, Sweden
Elke Zakel, Germany