the Fifth International IEEE Symposium
On High Density Packaging and Component Failure Analysis (HDP'02)
The 5th International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP'02) was successfully held from 30th June to 3rd July 2002 at Galaxy Hotel in Shanghai, China.
The HDP'02 were jointly organized by the DaimlerChrysler SIM Technology Co. Ltd., Shanghai, China and the Division of Electronics Production, Chalmers University of Technology, Göteborg (Gothenburg), Sweden. The HDP '02 were technical co-sponsorship by IEEE CPMT Beijing Chapter, IEEE-CPMT Society, IEEE CPMT Scandinavian Chapter and Shanghai Institute of Microsystem and Information Technology.
The opening of the Symposium was held on 1st July 2002 at Galaxy Hotel in Shanghai, China. Opening speeches were given by Prof. Keyun Bi, Vice Chairman of The Semiconductor Society of China and Chairman of China Electronic Packaging Society; Mr. Eskil Lundberg, General Consul of the kingdom of Sweden, Shanghai; Prof. Ming Qi, Depute Director of SIMIT, China; Prof. James Morris, Vice president of IEEE CPMT Conference, USA; Prof. Jushen Ma, Chair of IEEE CPMT China Chapter and Prof. Johan Liu, Chair of IEEE CPMT Scandinavian Chapter. The General Manager of DaimlerChrysler SIM Technology Co. Ltd., Dr. Frank Stubhan also gave a welcome note.
Six wellknown experts were invited to give short courses at the first day of this symposium.
The six short courses included:
1. Failure analysis on board and component level
By Göran Wetter, Senior Materials and Failure Analysis Specialist in IVF, Sweden
2. Electronics cooling: problems, methods and trends
By David W. Shao, Ericsson, Sweden
3. SMT process overview including solder joint reliability
By Wayne Koh, Kingston Technology Company, USA
4. Area array packages & microvias for low-cost high density
By Ricky LEE, University of Sciences and Technology, Hong Kong
5. Optical Telecommunication Networks and Optoelectronic Packaging
By Yifan Guo, Conexant Systems, Inc., USA
6. Lead-free solders for electronics packaging application"
By Johan Liu, Chalmers University of Technology, Sweden
It was a great honor for the organizing committee to have invited Prof. Rao Tummala, director of Packaging Research Center of Georgia Tech, USA to give a keynote speech on "High Density Packaging in 2010" And Dr. Robert C. Pfahl, Advanced Packaging Center of Motorola, USA to give a keynote speech on "Design of Environmentally Preferred Electronic Products".
The symposium has received 50 technical papers among which 49 were published in the proceedings. Around 150 people attended this symposium. Speakers from China, Finland, Japan, Germany, Norway, Singapore, Sweden, USA, UK and Hong Kong presented their results.
Extensive discussions were made among all the experts, scholars and engineers from domestic and overseas, regarding important issues on electronic packaging such as lead-free soldering, flip chip technology, material issues, process and reliability, system integration, failure analysis etc. The successful opening of the symposium will certainly promote the advancement of electronic packaging and manufacturing industry in China.
As discussed by the International Technical Committee and International Advisory Committee, the next event is scheduled on June 25 to 28, 2004 in Shanghai.
For more information of the symposium, please:
Picture of snack tables
Picture of demonstrations
Rao Tummala, President of IEEE/CPMT presenting "Future of Microsystems"
All the attendees pose for history
Pictures from sessions: first second third fourth fifth sixth seventh
Drinks -- Songs -- and Fire -- just like your university days.
Visit the web page HTTP://www.HDP.COM.CN
For further information please contact Johan Liu at firstname.lastname@example.org or Xiaoming Xie at email@example.com
Submitted by Johan Liu and Xiaoming Xie