ICEP 2002 Success in Tokyo
The International Conference on Electronic Packaging 2002, formerly called IEMT/IMC Symposium, was held on April 17 to 19, 2002 at Dai-ichi Hotel Tokyo in Tokyo, Japan. The keyword of the conference was "New Packaging Wave from Asia" reflecting rapid growth of Asian industries in electronic packaging. There were about 360 attendees from 16 countries (attendees from foreign countries were 57). Total of papers were 94 including "Invited Speech" and special "Asia session" papers. The Asia session was held as a new session, Dr.Bauer, President of IMAPS North America delivered an Invited Speech, "Device packaging in the year 2002".
The Asia session consisted of five presentations from Asian countries,
except for Japan. The speakers were Prof.Y.B.Sun from Korea, Dr.M.K.Iyer
from Singapore, Prof.J.Ma from China, Prof.J.K.Kim from Hong Kong
and Prof.S.L.Fu from Taiwan. They told about research organization,
development activity and production capability of their own countries
in the area of semiconductor and electronic packaging.
Three papers were awarded as "IEEE CPMT Young Award";
(1) "Evaluation on the Properties of Sn-Ag-Bi Solder with
Low Melting" by H. Shimokawa et al., Hitachi
(2) "Giga-p: A Low-cost and Compact Parallel Optical Link
Module for Very Short Reach Interconnect" by T. Sakamoto
et al., NTT
(3) "Development of the Non-flux Solder Joint Technology"
by R. Okada et al., Sumitomo Bakelite.
Professor Noboru Ichinose, Chair of IEEE CPMT Japan Chapter, awarded
certificates to them Congratulations.
Announcement to 2003 ICEP
It has been set that 2003 International Conference on Electronics
Packaging (2003 ICEP) will be held on April 16 to 18, 2003 in
Tokyo. 300 word abstract deadline is October 22, 2002 and full
paper should be submitted by February 2003. 17th Microelectronics
Show, a synchronized exhibition, will also be held.