CALL FOR PAPERS

9th International Symposium and Exhibition on Advanced Packaging Materials, Processes Properties and Interfaces

March 26-28, 2003
Atlanta, Georgia U.S.A.

WHO SHOULD ATTEND?
Attendees of this symposium in the past have been comprised of researchers, developers, producers and users of materials for single and multichip packages, interconnections, substrates, microwave applications, optoelectronic packages and display panels.

Sponsors:
IEEE Components, Packaging and Manufacturing Technology (CPMT)
Packaging Research Center at Georgia Tech (GT PRC)

Technical Sponsors:
Fraunhofer IZM, Germany

General Chair:
Dr. Andreas Schubert
Fraunhofer IZM, Germany

General Chair Elect:
Professor Jianmin Qu
Georgia Tech, USA

Technical Chair:
Dr. Petri Savolainen
Nokia, Finland

Technical Chair Elect:
Professor Suresh Sitaraman
Georgia Tech, USA

Technical Sessions (Session Chairs):
MEMS and Thin Films (Phil Garrou and Katarina Boustedt)
Adhesives (Jim Morris and Johan Liu)
Underfills (Quinn Tong and CP Wong)
Encapsulants and Coatings (Ray Pearson and Dan Baldwin)
Bumping Materials and Processing (Rolf Aschenbrenner and Dan Scheck)
Solders (Ricky Lee and Rajen Chanchani)
Substrates, HDI and Dielectrics (Petri Savolainen and Mark Maline)
Manufacturing and Reliability (Andreas Schubert and Suresh Sitaraman)
Passive Materials (Larry Mann and George White)
New Topics:
Nano Materials, Optical and RF materials (Rao Tummala, Phil Garrou and Jim Morris)
Posters (Jianmin Qu and CP Wong)

Abstracts:
If you are interested in presenting a paper at this symposium, please send an abstract (~ 300 words) to Dr. Petri Savolainen via e-mail at
petri.jo.savolainen@nokia.com Please include your affiliation, mailing address, phone number and e-mail address in your submission. The deadline to receive the abstract is October 10, 2002.

Important Dates:
Submission of abstract: 10 October 2002
Notification of acceptance: 10 December 2002
Submission of manuscript: 15 January 2003

For More Information:
Please contact the technical chair of the symposium

Dr. Petri Savolainen
Nokia
Itamerenkatu 11-13
Helsinki, 00180
Finland
Phone: +358-7180-39382
Fax : +358-7180-37143
E-Mail: petri.jo.savolainen@nokia.com

or

Marcus Johnson
813 Ferst Drive, Room 351
Atlanta, Georgia 30332-0560 U.S.A.
+1 404-385-1220
E-Mail: mjohson@ee.gatech.edu