Status of the CPMT Technical Committees
Phil Garrou - CPMT Technical VP
After a few years of updating and renovation, I thought it would be good to review the status of the CPMT technical committees with you the membership.
We currently have 18 active technical committees. In the last two years 9 new Chairs have taken over. We are truly International in scope with 3 committees being chaired from Europe and one from Japan.
From the CPMT web page (https://www.cpmt.org/tc/index.html
) you can see that we are organized in four distinct areas
:
Core technologies; components and devices; packaging and process
and manufacturing. From this page you can jump to the individual
web pages for the TCs. Although we try to make sure these are
continually updated, you will see that some groups are better
at this than others.
Core Technologies:
Materials | Rajen Chanchani | Sandia -- 1 505 844 3482 |
Reliability | Kirk Gray | AcceleRel, -- k.a.gray@ieee.org |
Thermal Management & Design | Tony Mak | Dallas Semi -- 1 972 371 4364 |
Education | Rao Tummala | Georgia Tech -- 1 404 894 9097 |
Photonics | Frank Shi | UC Irvine -- FGSHI@uci.edu |
Electrical Test | Bruce Kim | Arizona State -- Bruce.Kim@asu.edu |
Design, model, Simulate | Madhaven Swaminathan | Georgia Tech -- 1 404 894 3340 |
Components and Devices:
Electrical Contacts | Gerry Witter | Chugai 1 708 244 6025 |
Passives | Len Schaper -- 1 501 575 8408 | University of Arkansas |
Packaging:
Assembly | Michelle Berry | Intel -- michele.j.berry@intel.com |
Power | Doug Hopkins | SUNY Buffalo -- 1 607 729 9949 |
RF | Craig Gaw | Motorola -- 1 480 413 5920 |
Wafer Level | Michael Toepper | IZM Berline -- toepper@izm.fhg.de |
High Density PWB Systems | Yoshitaka Fukuoka/John Segelken/Connie Swager | weisti.fukuoka@rose.zero.ad.jp |
MEMS | Erik Jung | ISM Berline -- erju@izm.fhg.de |
Process & Manufacturing:
Electronic Manufacturing | Walt Trybula | NCMS -- 1 512 356 3306 |
Green Manufacturing | Hansjorg Griese | IZM Berlin -- griese@izm.fhg.de |
If you are actively working in any of these areas, please contact the chairman and volunteer to join the committee. You will be networking with the best in your field.