Status of the CPMT Technical Committees

Phil Garrou - CPMT Technical VP

After a few years of updating and renovation, I thought it would be good to review the status of the CPMT technical committees with you the membership.

We currently have 18 active technical committees. In the last two years 9 new Chairs have taken over. We are truly International in scope with 3 committees being chaired from Europe and one from Japan.

From the CPMT web page (https://www.cpmt.org/tc/index.html ) you can see that we are organized in four distinct areas :
Core technologies; components and devices; packaging and process and manufacturing. From this page you can jump to the individual web pages for the TCs. Although we try to make sure these are continually updated, you will see that some groups are better at this than others.

Core Technologies:

 Materials Rajen Chanchani Sandia -- 1 505 844 3482
Reliability Kirk Gray AcceleRel, -- k.a.gray@ieee.org
Thermal Management & Design Tony Mak Dallas Semi -- 1 972 371 4364
Education Rao Tummala Georgia Tech -- 1 404 894 9097
Photonics Frank Shi UC Irvine -- FGSHI@uci.edu
Electrical Test Bruce Kim Arizona State -- Bruce.Kim@asu.edu
Design, model, Simulate Madhaven Swaminathan Georgia Tech -- 1 404 894 3340

Components and Devices:

 Electrical Contacts Gerry Witter Chugai 1 708 244 6025
Passives Len Schaper -- 1 501 575 8408 University of Arkansas

Packaging:

 Assembly Michelle Berry Intel -- michele.j.berry@intel.com
Power Doug Hopkins SUNY Buffalo -- 1 607 729 9949
RF Craig Gaw Motorola -- 1 480 413 5920
Wafer Level Michael Toepper IZM Berline -- toepper@izm.fhg.de
High Density PWB Systems Yoshitaka Fukuoka/John Segelken/Connie Swager  weisti.fukuoka@rose.zero.ad.jp
 MEMS Erik Jung ISM Berline -- erju@izm.fhg.de

Process & Manufacturing:

 Electronic Manufacturing Walt Trybula NCMS -- 1 512 356 3306
Green Manufacturing Hansjorg Griese IZM Berlin -- griese@izm.fhg.de

If you are actively working in any of these areas, please contact the chairman and volunteer to join the committee. You will be networking with the best in your field.