CPMT President Rao Tummala opened the November 9 Board meeting. He announced the decision to have two general Board meetings every year plus one strategic global workshop held at a different site with CPMT significance (co-located with a CPMT supported meeting). The two upcoming general board meetings will be on Saturday May 31 in New Orleans and in Dallas November 8, 2003.
Rao wanted to thank the six board "Members at Large" that were elected by membership and have served for the last 3 years: Alina Deutsch, Koji Nihei, James Steele, Ephraim Suhir, Jan Vardaman, and Walt Trybula.
Despite the huge taxes made necessary by IEEE uncovered expenses, our Society is still in great financial shape. This is remarkable considering near bankruptcy in 1991. Rao attributes much of this financial success to retiring long time treasurer Merrill Palmer. He also announced that John Segelken will be taking over the CPMT counting house.
Strategic Focus
Rao reviewed some of the achievements of our Society.
The ongoing leadership meetings in Region 8 and 10 are a good example of where new CPMT leaders may come from. Our technical committee chairs can now come from anywhere in the world. For years the elected Board members have reflected the global distribution of members fairly accurately (see last issue of Newsletter). Another vote for the extent of globalization is the high attendance of CPMT sponsored meetings all around the world.
Our education programs keep expanding. Part of this is because 80% of our members are in industry and do not have the automatic upgrade in their education that occur on campus. We have very successful set of 14 short courses at ECTC. We have roving seminars. We have taken the first big steps toward having web courses that can be taken from your office. CPMT holds a regular Academic Conference that gathers professors from many universities to compare notes in educating in the CPMT specialties.
For a few years we have been testing the efficacy of Student Chapters on campus that have CPMT themes.
We have begun consistently presenting the "CPMT" brand name in our meeting, publication, and news releases. Most members have noticed in trade magazines and international news reports references to our Society and quotes from our volunteers.
Rao announced that he was ready for the review by the IEEE/TAB in November. In addition to the detailed review of finance and publication, Rao has set a goal of educating the TAB on the changing needs of industry to system integration rather than only component focus in our Packaging, Assembly, Thermal, Reliability, and Manufacturing themes.
Partnership ECTC
An updated partnership agreement between CPMT and EIA/ECA over the sponsorship of the ECTC is under review and will be voted on at the New Orleans ECTC meeting in May. The agreement clearly separates the financial details from the organizational details. Many of the traditional performed processes are being explicitly stated. In particular the responsibilities of each team will be stated, in addition to the formulas for sharing costs and profits. Part of this clarity is being brought on by a new management system. Direct discussions between Bob Willis, President of ECA, and Rao Tummala, CPMT President are responsible for much of this progress.
Upcoming ECTC
Steve Buzek described the gathering momemtum of the New Orleans ECTC. This year the paper committee had 479 submitted abstracts, a new record. Of these 300 were chosen for presentation, approximately 50 more than last year. There will be 36 sessions with 6 running parallel. Each session will have 7 papers. In addition, there will be 2 poster sessions with 35 papers in each. Steve was happy to say that most of the paper submission and selection is electronic now. This saves many hours of volunteer labor from the past. It is expected that there will be 80 technical corner marketing displays. Approximately 50 are spoken for already. Although it would be hard to beat the turn out in San Diego of 1000, the momentum gathering for New Orleans seems comparable. The income from the San Diego ECTC that will be added to the CPMT operating budget is comparable to years in the past, reports Wayne Howell…another success by all measures.
European Leadership Conference
Johan Liu of Sweden discussed to possibility of a one day strategy meeting in Berlin immediately after the Cork Ireland system packaging workshop (January 23-24, 2003). The aim is to begin developing a European CPMT coherent leadership that would:
1. Establish/support a major conference in Europe
2. Hold an annual Chapter Chair meeting
3. Establish CPMT recognition in Europe.
4. Coordination of existing chapter meetings, conferences, and short courses to increase attendance
5. Increase CPMT volunteer and membership base.
With some encouragement by the Board it is expected that approximately 20 leaders would be able to participate in this meeting.
Publications
Paul Wesling, Vice President of Publications discussed the new activities. A new CD-ROM is being assembled that will include the transaction articles from 2000 - 2002, as well as the complete index of all articles every published in the IEEE precursors to today's transactions.
Paul reports that "Manuscript Central" is working well and is keeping authors aware of where their article is in the pipeline. This automation costs $10K/ transaction but is worth a lot to the editors and authors. This new efficiency is helping us remain "the publisher of choice" for the productive engineers in our fields.
Paul is always looking for associate editors in particular subject areas such as quality, assembly, and integration. Paul also presented a detailed plan to add a new transaction on Electrical Performance to our set of Publications. There are 2 years of up front costs before the IEEE "all publications package" funds begin to compensate the Society. However, one of the areas of concentration for our members that has grown the fastest has been the electrical description of high performance packages. There was much descussion of the exactly right name for the Transaction and the best timing for initiation (since IEEE is still taxing the Society at a high rate). It was agreed to go ahead with the IEEE approvals and detailed budget planning steps.
Paul mentioned two new IEEE Press books with CPMT backing
1. Lead-Free Solders and Soldering, by Edwin Bradley.
2. Integrated Passives, by Rick Ulrich
Administration
Anthony Chan, Vice President of Administration, described the improvements in the web site which is set up to provide information to Board members. (ed. One of the advantages is that we no longer have to lug huge piles of paper to each meeting but rather read everything ahead of time and download what you need for discussion).
George Harman has been in charge of the Fellow Committee for 15 years. During that time the society went from having a hand full of fellow to now having 130. George's team was responsible for assisting with about 70 of these nomination packages. George is resigning from this post and C. P. Wong has agreed to take over. To continue this success, David Palmer was appointed to co-chair with Rao Tummala in a Fellows Search Committee. The aim is to make the nomination process easier for our senior members. It was stressed that we must also continue to push for Senior Members as well as Fellows.
An Asian leadership Workshop is being heal in Kaoshsing Tiawan on December 6th and in Sigapore later. Members will share activity planning that have made their local chapter more effective. Current plan was to have William Chen work with the industrial representatives, Paul Wesling with the general Attendees, and Prof Fu with the University attendees.
John Segelken said the Board Election would be over by November 20th (see elsewhere in Newsletter)
Education
Al Puttlitz, Vice President Education, discussed the distinguished lecturer program. He proposed adding 2 experts to the list making for a total of 20 lecturers. Four lecturers have received travel assistance this year and another 3 trips are projected.
Al discussed the upcoming ECTC professional development courses (short courses). Al, Rao Bonda, and Ron Scotti (chair) have found 4 new courses to replace 4 of the 14 given last year:
1. Photonics Packaging, Design for Reliability, Ephraim Suhir -Univerity of Illinois, Chicago
2. Wafer Level-Chip Scale packaging, Luu Nguyen - National Semiconductor
3. Packaging Challenges for 10Gb/s and 40Gb/s, Hassan Hashemi and Robert Coccioli
4. Integrated Passive Technology, Richard Ulrich - University of Arkansas.
International Activities
C. P. Wong reviewed activities throughout the world where local CPMT chapters held events where the Board could provide a little help.
**SMT Miscrosystems in Germany June 2002
**Polytronic 2002, Zalaegraezy, Hungary, June
**HDP'02 Shanghai, China, July
**Semicon West and IEMT, San Jose, July
**Costa Rica, Intel Workshop, 400 Packaging and Assembly engineers considering CPMT chapter
**EMAP 2002 &Leadership Conference, Kaoshsing, Taiwan, December
**EPTC 202 & Leadership in Manufacturing, Singapore, December
Membership
Ralph Russell, Director Membership, reported that our new total membership is 3825 slightly down from last year. There were gains in SE USA and in South America last year. Losses occurred in Western USA and Asia. It was mentioned that in Japan alone, IEEE membership has dropped more than 30%.
On an individual and on a company basis this is a time when all think twice before paying dues. But since we see the number of papers submitted to CPMT conferences are increasing from Europe and Asia as well as North America, the Boards view is that we must just keep doing what the members benefit from and the number of members and volunteers will grow.
Ralph has put together a new Membership Brochure, is updating the Membership Web Site, and has a Renewal Letter sent to those that are slow in response at the end of the year.
Conferences
James Morris, Vice President of Conferences, discussed trends in conferences in the last year. A decrease in attendance occurred which seems a combination of frugality of companies not making money, and individuals trying to survive in a dangerous world. The conference committee consists of Rolf Ashenbrenner, Jack Balde, Ricky Lee, Jim Steele, and Jan Vardaman. They review all new conference request to make sure they are consistent with members needs and do not conflict with existing meetings. New conference proposals include concepts such as "a European ECTC" and a summer school full of short courses.
Even popular meetings of long standing can have a bad financial year if the planning has a hiccup. For example the Packaging Materials symposium may lose $10K for the 2001 meeting. Jim received votes of support for the 3 new meetings that he proposed:
1. Conference on the Business of Electronic Product Reliability and Liability, Hong Kong & Shenzhen China, January 2003
2. IEEE International symposium on Quality Electron Design (ISQED), San Jose, March 2003
3. International IEEE Conference on the Environmentally compatible Microelectronics Packaging, Manufacturing, and Design Technology, Hong Kong & Shenzhen, June 2003.
Slow progress is being made on having each meeting plan for a 15% surplus to help support the activities of CPMT for the members in there region (including the Newsletter, access to IEEExplor, Distinguished Lecturers).
Media Relations
Connie Swager, Director of Marketing, summarized the progress made in the last year by her staff working with Potomac Communications. She mentioned there were over a million media impressions (circulation # X number of mentions for CPMT). In particular many members have noticed Society mention in "Advanced Packaging", "EP&P", IEEE Spectrum, EE Times. Two issues of OutLook Marketing Newsletter have been published and given wide distribution. Many one-pager fact sheets are available for anyone to use for marketing: Conferences, Education, Distinguished Lecturers, Awards, Technical Committees. Many logos and standard colors have been established on letter head, business cards, pocket folders…all to give common recognition of the CPMT source. Several spokesman for CPMT have been trained in being effective with the media.