ANNOUNCING THE FIRST TITLE IN THE IMAPS SERIES
Emerging Technology in Advanced Packaging

Foldable Flex and Thinned Silicon Multichip Packaging Technology
edited by
John W. Balde
Interconnection Decision Consulting, Flemington, NJ, USA

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis.

The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future.

It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.

Contents:
1. 3-D Assemblies of Stacked Chips and other Thin Packages
John Balde

2. Multi-Chip Carriers in a System-on-a-Chip World
Evan Davidson,

3. Packaging Technologies for Flexible Systems
Catherine Kallmayer

4. Low Profile and Flexible Electronic Assemblies
Using Ultra-Thin Silicon - The European Flex-Si Project
Thomas Harder

 

5. Thin Chips for Flexible and 3-D Integrated Electronic Systems

Karlheinz Bock, Michael Feil, Christof Landesberger

6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices
Jeorg-Uwe Meyer, Martin Schuetter, Oliver Scholz,
Werner Haberer, Thomas Steiglitz

7. Folded Flex and other Structures for System-in-a Package
Mike Warner, Bill Carlson

8. Valtronic CSP3D Technology
Georges Rochat, Phillipe Clot, Jean-François Zeberti

9. 3-D Packaging Technolgies: Are Flex based Solutions the Answer ?
Ted Tessier

10. Availability of High Density Interconnect Flexible Circuits
E. Jan Vardaman, Dominique Numakura

11. Recent Advances in Flexible Circuit Technology
Using Liquid Crystal Polymer Substrates
Rui Yang and Terry F. Hayden

12. Flex and the Interconnected Mesh Power System ( IMPS )
Leonard W. Schaper

13. Thermal Management and Control of Electromagnetic Emissions
Carl Zweben

Conclusions
John Balde

Kluwer Academic Publishers, Boston
Hardbound, ISBN 0-7923-7676-5
December 2002 , 360 pp.
EUR 187.00 / USD 185.00 / GBP 120.00

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