1st CALL FOR PAPERS
Thermal & mechanical simulation and experiments in micro-electronics and micro-systems

April 6 - 9, 2003
Aix en Provence, France

The Conference
After three successful editions of the EuroSimE conference, a fourth edition is planned in 2003 and will take place in the beautiful Provence in the South of France. This EuroSimE 2003 will address the results of both fundamental research and industrial application for thermal, mechanical and thermo-mechanical solutions of (micro)-electronics, focusing on advanced simulation and experiments. The conference will include keynote presentations and sessions with a wide range of topics including, but not limited to:

Subjects:
· mechanical simulation (static & dynamic)
· thermo-mechanical simulation
· thermal simulation (steady state & transient)
· multi-physics simulation (coupled thermo-fluidic problems, coupled electro-mechanics, fluid-structure interactions)
· validation of simulations by experiments
· material characterisation, experiments and modelling
· failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield)
· process modelling
· advanced numerical and analytical simulation methodologies and tools
· behavioural modelling (HDL-A)
· thin-film mechanics, interface strengths
· simulation-based optimisation, virtual prototyping in product and/or process design
· compact modeling and model order reduction Applications:
· Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM)
· MEMS (pressure, accelerometers, gyroscopes) and MOEMS
· Chip level reliability
· Nanotechnology
· Opto-electronic packages
· High Temperature Packaging
· Piezoelectric components
· Wafer processing and chip design
· PWB design and application
· Packaging for Harsh Environments
· Fluidic Components (microvalves, ink-jet nozzles, …)
· Infrared sensors and cameras, thermal actuators
Conference features
· Short courses (April 6) will be offered for professional training. The subjects will be announced later.
· Three days of technical sessions (April 7 - 9) for oral and poster presentation.
· A parallel exhibition from industrial contributors and simulation and optimization software companies.
To Submit an Abstract
You are invited to submit an abstract of about 500 words by fax, mail, or email describing the scope, content, and key points (originality, specific results, potential impact) of your proposed paper to:
L.J. Ernst
Delft University of Technology, P.O. Box 5033, 2600 GA Delft, The Netherlands
Email: l.j.ernst@wbmt.tudelft.nl Tel.: +31 152 78 6519 Fax: +31 152 78 2150
http://www.eurosime.com/
Abstracts must be received by October 15, 2002. Authors will be notified by December 1, 2002. Deadline for the final manuscript is January 28, 2003.