This International Academic Conference Workshop will provide opportunity for faculty to present courses, curriculum, and other educational programs they have developed; as well as exchange ideas on how to improve the status of microsystem packaging education.

Structure:

Presentation Session: Novel Electronic Packaging Education Program

Panel Session: Assessment of Packaging Courses and Programs

Moderator -- Avram Bar-Cohen, University of Maryland

Round Table Discussion: International Partnership and Exhange Programs

Moderator -- Rao Tummala, Georgia Institute of Technology