Synopsis of the 2002 Optoelectronics Packaging and Manufacturing Symposium,

Binghamton University, State University of New York, Binghamton, New York October 21-23, 2002

John W. Stafford
JWS Consulting P.L.C.
j.stafford@ieee.org

There were 15 presentations made at the symposium. The presentations were: (1) "Current State of Optoelectronic Networking" by Gary Kunic, (2) "Optoelectronic Opportunities and Developments in the EMS Space" by Srinivas Rao, (3) "International Standards for Optoelectronic Technology" by Thomas D. Newton, (4) "Optoelectronics and Automation for First Level Package Assembly" by Richard Boulanger, (5) "Optimization of the Fiber Optics Splicing Process" by Harjinder Lahhar, (6) "Evaluation of Soldering Techniques in Optoelectronics Assembly" by Alan Rae, (7) "A preview of the NEMI Year 2002 Optoelectronics Roadmap" by John W. Stafford, (8) "The Evolution of Optics in Printed Circuit Boards" by David Haas, (9) "Selective, Scalable Semi-Automation of Fiber Optic Components" by Ernie Bancroft, (10) "Optoelectronics Packaging , Design, Materials and Process Issues by Peter Borgesen, (11) Packaging of High End Photonics Components" by Kevin Dreyer, (12) "40G for $4; Essentials for Next Generation Passive Optical Components" by Laurence A. Harvilchuck, (13) "Demand for Specialist Materials and Components in Optoelectronics" by Melanie Wuthenow, (14) "Optoelectronics Business Development in Asia" by E. Jan Vardaman and (15) "The challenges of Optical MEMs Assembly" by Larry Felton. In addition students at Binghamton University who were working on electronics packaging research projects as part of the Integrated Electronics Engineering Center (IEEC) presented poster papers on their research results.

The keynote speaker was Gary Kunis, VP Cisco Systems. In his second slide he succinctly pointed out the state of network deployment with his statement "The bandwidth party is over". Business deployment is now focusing on metro optical, Ethernet to the home/curb and storage networking. A more realistic business model for deployment of optoelectronics is emerging. He went on and gave an excellent optical network overview.

In a short synopsis it is impossible to give even a short review of the many excellent presentations but there were a number of common themes in several of the presentations. A theme that was echoed in a number of presentations was the need for standards to be more quickly developed due to the rapid technology advances. This is particularly true for packages, etc. A number of presentations reviewed optoelectronics packaging and assembly issues including the vexing problem of fiber handling and splicing. To complement these presentations a number of presentations discussed the benefits of on board and in board optical wave guides and their applications using flip chip vertical cavity surface emitting Laser (VCSEL's) and detectors. Such technology application would be used in Level 3 backplanes. Methodologies for coupling into and out of the wave guide were broadly reviewed and discussed. A number of the presentations focused on the benefits of automation (particularly yield) the cost effectiveness of automation.. The review by E. Jan Vardaman on the Optoelectronics Business Development in Asia highlighted the growth and diversity of the optoelectronics technology and business infrastructure in the Peoples Republic of China.