CPMT Meeting of Interest to Members

2003

**IEEE Internat Symposium on Quality Electronics Design (ISQED), March 24-27, 2003, San Jose, California; Ali Iranmanesh, Alii@tavanza.com, +1 408 330 1236, fax +1 408 986 5095.

**CARTS 2003, Capacitor and Resistor Technology Symposium, March 29 - April 4, 2003, Scottsdale, Arizona, www.cti-us.com.

**4th Conf on Thermal & Mechanical Simulation & Expts in Microelec & Microsyst (EUROSIME), Aix-en-Provence, France, March 30 - April 2, 2003, compete@mta.fr, fax 33 1 4451 7401

**2003 International Reliability Physics Symposium, Dallas, Texas, March 30 - April 3, 2003, http://www.irps.org

**14th Annual IEEE/SEMI Advanced Semiconducotr Manufacturing Conference & Workshop (ASMC), March 31 - April 1, 2003, Munich Germany: Margaret Kindling, mdindling@semi.org, fax: 1 202 289 0441 or Johanna Turpeinen, europrograms@semi.rog, fax +32 2 511 4345.

**2003 International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 16 - 18, 2003, imaps-j@jiep.or.jp, fax 81 3 5310 2011

**5th International Conference on Electronics Packaging Technology (ICEPT 2003), Shanghai, China, April 21 - 23, 2003, jjwant@srcap.stc.sh.cn, fax 86 21 65643529

**International Spring Seminar on Electronics Technology, High Tatra, Slovakia, May 8 - 11, 2003, alena.pietrikova@tuke.sk, fax 421 55 6023195

**7th IEEE Workshop on Signal Propagation on Interconnects (SPI'03), May 11-14, 2003; Siena Italy, ; canavero@polito.it, +39 011 564 4060.

**2003 IEEE 53rd Electronic Component and Electronics Technology, May 27 - 30, 2003, New Orleans, Louisianna., jadams@eia.org, fax 1 703 907 7549

**Int'l IEEE conference Environment on Compatible Microelectronics Packaging, Manufacturing, & Design Technology, June 23-24, Hong Kong; June 25-27, 2003 Shenzhen, China; angie Wong, wywong@ee.cityu.edu.hk, fax 852 2788 7579.

**InterPACK'02 (Inter-society Packaging Conference), July 6-11, 2003; Maui, Hawaii; S. K. Bahattacharya, swapan@ee.gatech.edu, fax 1 404 894 0957.
 
**International Electronics Manufacturing Technology (IEMT) Symposium July 16-18, 2003; San Jose CA Gloria Lou: glou@semi.org +1-408-943-7048 (fax +1-408-943-7913)

**9th International Workshop on Thermal Investigations of ICs & Systems (Therminic) September 24-26, 2003; Aix-en-Provence, France Bernard Courtois THERMINIC@imag.fr

**TC-7 2003 Workshop on Accelerated Stress Test & Reliability (AST'03) October 2-4, 2003; Seattle WA Mark Morelli Mark.Morelli@Otis.com +1-860-676-6140
**MST'03 (Microsystems Technologies), Munich Germany, October 7 - 8, 2003, Erik Jung, erju@izm.fhg.de, fax 49 30 46403 161
 
**3rd Internat IEEE confer on Polymers & Adhesives in Microelectronics & Photonics (Polytronic 2003), Montreux, Switzerland, October 20 - 23, 2003, Bernard Courtois, polytronic2003@imag.fr

**5th Electronics Packaging Technology Conference (EPTC'03), December 10-12, 2003, Singapore; Mahadevan Iyer, iyer@ime.a-star.edu.sg, fax +65 6774 5747.

-- submitted by Jim Morris, Vice President of Conferences