PRESS RELEASE

FOR IMMEDIATE RELEASE Contact: Jim Bruorton
(864) 963-6621

(New Orleans, Louisiana .....May, 2003)--The Advance Program for the 53rd Electronic Components & Technology Conference at the Sheraton New Orleans Hotel has been completed and will feature over 300 technical papers presented by leaders in their field representing countries from around the world.
The conference is organized into 38 technical sessions covering a wide range of topics, including optoelectronics, RF and MEMS packaging, 3D and high performance package design, flip chip and Pb-free interconnections, wafer-level packaging and manufacturing, reliability test methods, and electrical, thermal and mechanical modeling. Two technical sessions will specifically explore topics related to engineering education and web-based packaging education for the 21st century.
Two poster sessions on Wednesday, May 28 and Thursday, May 29 will offer unique opportunities for authors and attendees to interact, discuss in detail, and exchange ideas in a more relaxed forum.
New this year is the International Academic Workshop (sponsored by the Packaging Research Center) to be held in conjunction with ECTC as a one-day workshop on Tuesday, May 27. The purpose of this workshop is to make the academic community aware of the significant advances being made worldwide in next generation electronic packaging education and to promote international collaborations that serve the global technical community.
The 53rd ECTC will feature a Tuesday evening, May 27 Panel Session on "Trends in Advanced Packaging Development and Manufacturing", and a Wednesday evening, May 28 Plenary Session organized by Dr. Phil Garrou focusing on "The Coming Changes in IC Technology".
An all-day educational seminar will be offered on Tuesday, May 27, 2003 consisting of 14 short courses. Dr. Ronald E. Scotti and the short course committee have brought together industry experts from a wide variety of disciplines to offer state-of-the-art technology reviews and updates in condensed half-day and full-day formats. Course topics cover a wide range of technologies, including RF/wireless packaging, Ghz IC packaging, photonic-optoelectronic packaging and systems, systems on a package, chip scale and wafer scale packaging, integrated passive technology, and polymers for electronic packaging. These courses are eligible for Continuing Education Unit (CEU) credits.
The Technology Corner on Wednesday afternoon, May 28 and Thursday, all-day May 29 will feature exhibits of the newest products and services available in an environment that enables discussion and interaction with the managers, engineers, and scientists attending ECTC.
ECTC attendees can receive Conference Proceedings as a CD-ROM or a printed version. Both the CD-ROM copy and printed may be purchased for an additional $50 charge.
We encourage any editorial coverage you can give the conference and will provide complimentary registration and proceedings for your editorial representative planning to attend.

The 53rd ECTC Advance Program is available from:
Jim Bruorton, ECTC Publicity Chairman
2003 Electronic Components & Technology Conference
c/o KEMET Electronics Corporation
P.O. Box 5928
Greenville, SC 29606
Telephone: (864) 963-6621
Fax: (864) 963-6444
Email: margieballinger@kemet.com

or you may visit the ECTC website at www.ectc.net and download the information and program from that location.

The 53rd ECTC conference is sponsored by the Electronic Components, Assemblies, and Materials Association (the electronic components sector of the Electronic Industries Alliance) and the IEEE Components, Packaging and Manufacturing Technology Society.