CPMT Meeting of Interest to Members

2003

**Int'l IEEE conference Environment on Compatible Microelectronics Packaging, Manufacturing, & Design Technology, June 23-24, Hong Kong; June 25-27, 2003 Shenzhen, China; angie Wong, wywong@ee.cityu.edu.hk, fax 852 2788 7579.

**InterPACK'02 (Inter-society Packaging Conference), July 6-11, 2003; Maui, Hawaii; S. K. Bahattacharya, swapan@ee.gatech.edu, fax 1 404 894 0957.

 

**International Electronics Manufacturing Technology (IEMT) Symposium July 16-18, 2003; San Jose CA Gloria Lou: glou@semi.org +1-408-943-7048 (fax +1-408-943-7913)

**9th International Workshop on Thermal Investigations of ICs & Systems (Therminic) September 24-26, 2003; Aix-en-Provence, France Bernard Courtois THERMINIC@imag.fr

**TC-7 2003 Workshop on Accelerated Stress Test & Reliability (AST'03) October 2-4, 2003; Seattle WA Mark Morelli Mark.Morelli@Otis.com +1-860-676-6140

**MST'03 (Microsystems Technologies), Munich Germany, October 7 - 8, 2003, Erik Jung, erju@izm.fhg.de, fax 49 30 46403 161

 

**3rd Internat IEEE confer on Polymers & Adhesives in Microelectronics & Photonics (Polytronic 2003), Montreux, Switzerland, October 20 - 23, 2003, Bernard Courtois, polytronic2003@imag.fr

**5th Electronics Packaging Technology Conference (EPTC'03), December 10-12, 2003, Singapore; Mahadevan Iyer, iyer@ime.a-star.edu.sg, fax +65 6774 5747.

2003 IEEE Electrical Performance of Electronic Packaging (EPEP), Oct. 27-29, 2003, Princeton NJ; Paul Baltes baltes@engr.arizona.edu

5th International Conference on Electronic Materials & Packaging (EMAP), Nov 17-20,2003; Singapore; Sung Yi, sungyi@cecs.pdx.edu

2004

Int'l IEEE Confer on Asian Green Electronics (AGEC), January 5-9, 2004; Hong Kong/Shenzhen, China; Angie Wong, wywong@ee.cityu.edu.hk

1st International Workshop in Nano Bio-Packaging, May 23-24, 2004; Atlanta GA, wlp@ee.gatech.edu

54th Electronic Components and Technology Conference (ECTC), June 1-4, 2004, Las Vegas NV, www.ectc.net

-- submitted by Jim Morris, Vice President of Conferences