On May 28th Awards were given for best papers and posters at ECTC last year during the festive ECTC Luncheon. Wayne Howell gave an update on the improvements made at this year's ECTC followed by awards.

The best paper for ECTC 2002 went to "Sea of Leads Ultra High-Density Compliant Wafer-Level Packaging Technology" by Muhannad S. Bakir, Hollie A Read, Paul A. Kohl, Kevin P. Martin, and James D. Meindl of Georgia Institute of Technology. Steve Bezuk presented the award to Muhannad Bakir.

The Best Poster paper went to "Method to Evaluate the Electrical Performance of Printed Circuit Board Laminate Materials" by Michael J. Watkins of Motorola. Laura Mattin accepted the award.

The Outstanding Paper awards went to "The Digital Designer's complete Lossy Transmission Line Model" by Dave Quint and Karl Bois of Hewlett-Packard Company. Also getting this award was "Laser Spallation Adhesion Metrology for Electronic Packaging Development" by Mikel R. Miller and Michail C. Mello of Intel Corporation.

Two Outstanding Poster Papers were Cited. "Interfacial Fracture Toughness Test Methodology for Flip Chip Underfill Encapsulant" by H.L.J. Pang, X.R. Zhang, C.H. Lim, X.Q. Shi, and Z. P. Wang of Beijing and Singapore Universities. The second poster concerned Opto Couplers BGA Packaging by Fairchild.

These awards come with a plaque and a check which ethical engineers divide equally with all authors even those that can't make the award ceremony…or so we all like to believe.

At the end of the presentations, C. P. Wong representing the CPMT Society presented Wayne Howell with an award of appreciation for the excellent job he had performed as the General Chair of this year's ECTC.