FIRST CALL FOR PAPERS
54TH ELECTRONIC COMPONENT AND TECHNOLOGY CONFERENCE
To be held in Las Vegas, Neada, USA, June 1-4, 2004
The ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The ECTC is jointly sponsored by the Components, Packaging and Manufacturing Technology Society of the IEEE and the Electronics Industries Association. You are invited to sumit abstraccts that provide non-commercial information on new developments, technology and knowledge in the following areas:
Advanced Packaging
New packaging technologies, systems packaging, designs, materials and configurations addressing performance density and cooling for single chip, multichip, wafer-level, MEMS and power packages. Special emphasis on flip-chip, fine pitch and high lead count packaging in CSP, BGA, CGA, LGA, SMT packages.
Components and RF
New passive or active component technologies, integrated - embedded components, RF and wireless component applications, component performance, and systems and reliability.
Education:
Education for engineering curricula in the 21st century and collaborative research and engineering programs between universities, government, or industry; development and the use of multimedia for packaging education.
Interconnections:
First level electronic interconnection technologies including, flip chip, 3D interconnect, lead-free, MEMS interconnect, under bump metallurgy, substrate metallurgy and interconnect (HDI and microvia), wire-bonding, TAB, conductive polymers for interconnect (ICA, ACF, ACP, NCP), wafer and device level interconnection, electrical issues of advanced interconnect structures and novel interconnects.
Manufacturing Technology
Processes and equipment for wafer thinning, bumping and stacking, chip packaging, high density and embedded component substrates, test and burn-in. Emphasis on cost, yield, performance and environmental improvements, process characterization, new product introduction and ramp, design for flexible manufacturing and testing.
Materials and Processing
Technology, development and application of adhesives, encapsulants, flip chip underfills, solders and alloys, magnetic and optical materials, ceramics, composites, dielectrics, thin films, thermal materials, bonding and plating processes.
Modeling and Simulation
Electrical, thermal, optical, mechanical modeling, simulation, characterization and packaging solutions, including system-level applications.
Optoelectronics
Packaging for fiber-optic modules, infra-red wireless, consumer optoelectronics, flat-panel, projection and microdisplays, solid state lighting, optical amplifiers, lasers, detectors, OEICs, optical data interconnect, optical backplanes, passive components, and WDMs.
Posters
Papers may be submitted on any of the listed major topics; presentation of papers in a poster format is highly encouraged at ECTC.
Quality and Reliability
Assessment, failure analysis, reliability testing and data analysis, failure and acceleration models, qualification of components and systems, KGD, incremental quality improvement, and TQM
Submittals
You are invited to submit a 750-word abstract that describes the scope, content, and key points of your proposed paper via the website at www.ectc.net. If you have an questions. contact:
Patrick Thompson, Texas Instruments, Inc