Chapter News

Daejon (Korea) Chapter organized MicroElectronic Packaging Conference at Seoul KOEX as a joint activity of IEEE-CPMT and IMAPS-Korea. As reported by Prof. K.W.Paik, the conference was well attended with 150 delegates and covered latest developments on related technologies as per presentations from leading experts (including 4 invited speakers in Japan and 5 presentations from various universities/industries in Korea). Another jointly sponsored similar structured event is being planned for March 2004 at Seoul.

Hong Kong Chapter Chairman Dr.Cheung reported a successful workshop organized on "BGA Solder Joint Reliability - Failure Modes and Test Methods" by Prof. Keith Newman on 17th March 2003. The workshop was appreciated by about 70 delegates who attended the event. The Chapter plans to organize one more workshop on "Clean-room Technology" by Dr. Ken Goldstein in the coming months.

Taipei Chapter secretary Prof. Lih-Shan Chen, has reported a one-day co-sponsored symposium for Electrical and Information Engineering Symposium as organized on May 30 at I-Shou University, Kaohsiung. This well attended event was structured with 14 technical sessions to include 56 state-of-the art technical presentations on major topics covering materials characterization, opto-electronics technology, modeling and simulation, testing and measurements, image processing, automatic control, and wireless communication.

Prof. K M Seetharamu of Malaysia Chapter has reported his participation at the International Workshop on Electronic Packaging Education organized by IEEE-CPMT at New Orleans on May 27, 2003 where he presented a paper on "Electronic Packaging Education in University of Science Malaysia". He would be visiting Georgia Tech Packaging Centre and plans to take up further active work at his Chapter thereafter.

India Council Chapter organized two well-attended technical lectures during this period (in April and May 2003). The Chapter Execom has agreed to participate in the forthcoming 7th Annual convention of Surface Mount Technology Association India Chapter (SMTA-IC) as a joint activity at New Delhi on 16th to 18th July 2003. The 3 day event is being organized by DR. PARIKH as convener. Invited speakers including Prof. Manian Ramkumar of Rochester Institute of Technology, U.S.A, Mr. Aaron Saxton and Mr. Stanley Chen both of Universal Instruments Corp., U.S.A and Mr. William Tan of Dage Prestigious Industries, U.K. have agreed for keynote presentations at the convention and also conduct full day/ half day tutorials.

-- submitted by Dr. Parikh