Call for Papers
You are cordially invited to submit papers to the International IEEE Conference on Asian Green Electronics (AGEC). The conference will be held in Hong Kong and Shenzhen, China (transportation to Shenzhen will be provided). The purpose of the conference is to present the latest advancements in environmentally compatible electronics design, manufacturing and packaging technology. The goal is to help electronics companies design and manufacture green electronics products for the global market.
Theme & Purpose of the Conference
The purpose of the conference is to present the latest advancements in environmentally compatible electronics design, manufacturing and packaging technology. The goal is to help electronics companies design and manufacture green electronics products for the global market.
Hong Kong & Shenzhen's Electronics Industries
A global trend in today's electronics industry is the relocation
of advanced production plants and processes to the Guangdong province
in China and specifically to the city of Shenzhen bordering Hong
Kong. Today, Shenzhen is the major electronic manufacturing hub
of the world. Shenzhen provides the electronics industry with
an abundant supply of inexpensive land, subsidized state-of-the-art
factory leases and labor. China's World Trade Organization membership
should further enable Shenzhen to continue providing electronics
manufacturing services, as well as to move to the top of the electronics
industrial product chain in all aspects of product development.
With 35% of total export in electronics, Hong Kong is a strong
supporter of Shenzhen. In fact, Hong Kong provides design and
analysis support to China's manufacturing. In addition, half of
Hong Kong's electronics exports come from the electronic parts
and components industry, of which the largest export item is electronic
parts and accessories for computers, telecommunications and consumer
products.
Abstracts and Papers
Papers are now invited from other industry participants as well as researchers from academic and government organizations on the following topics:
Design for green electronics
Green manufacturing technologies including lead-free solders, conductive adhesives and other green technologies
Halogen free substrates
Environmentally Friendly Packaging and Design Technologies
Life Cycle Analysis and Assessment
Life Cycle Cost Analysis
Life Cycle Data Management
An electronic form of a one-page, 300 word abstract with name,
address, phone and fax numbers, and email address must be submitted
to the technical committee by email at wywong@ee.cityu.edu.hk
on/before September 01, 2003. Instructions for preparing the full
paper will be sent to authors whose abstracts are accepted after
review. Accepted papers will be published in a formal IEEE Conference
Proceedings with an ISBN number. Participants will be required
to register for the conference upon notification of acceptance
of their full papers
Important Dates
September 01, 2003 Abstract Submission
September 10, 2003 Abstract Acceptance
October 13, 2003 ------ Full Paper