CPMT Meeting of Interest to Members

2003

**Holm Conference on Electrical Contacts, Sept 8 - 10, 2003, Washington DC, www.ewh.ieee.org/soc/cpmt/tc1/

 

**9th International Workshop on Thermal Investigations of ICs & Systems (Therminic) September 24-26, 2003; Aix-en-Provence, France Bernard Courtois THERMINIC@imag.fr

**TC-7 2003 Workshop on Accelerated Stress Test & Reliability (AST'03) October 2-4, 2003; Seattle WA Mark Morelli Mark.Morelli@Otis.com +1-860-676-6140

**MST'03 (Microsystems Technologies), Munich Germany, October 7 - 8, 2003, Erik Jung, erju@izm.fhg.de, fax 49 30 46403 161

 

**3rd Internat IEEE confer on Polymers & Adhesives in Microelectronics & Photonics (Polytronic 2003), Montreux, Switzerland, October 20 - 23, 2003, Bernard Courtois, polytronic2003@imag.fr

 

**1st IEEE CPMT Regional Workshop on Microsystem Integration Technology, October 23-24, 2003, Shanghai, China, johan.liu@ivf.se

 

**FDIP03, Future Directions in IC and Packaging Design Workshop, October 26, 2003, Princeton New Jersey, www.epep.org.

 

**2003 IEEE Electrical Performance of Electronic Packaging (EPEP), October 27-29, 2003, Princeton, NJ, Paul Baltes, baltes@engr.arizona.edu

 

**ICEPT, International Conference on Electronic Packaging Technology, October 28-30, 2003, Shanghai China, www.icep2003.org.

 

**EDAPS03, Electrical Design of Advanced Packaging and Systems, Nov 10, 2003, Daejon Korea, teralab#ee.kaist.ac.kr

 

**5th International conference on Electronic Materials & Packaging (EMAP), November 17-20, 2003, Singapore, Sung Yi, sungyi@cecs.pdx.edu.

 

**5th International Workshop on Flip Chip, CSP, Wafer Level Packaging, December 1-2, 2003, Berlin, elke.zakel@ieee.org (German Chapter)

**5th Electronics Packaging Technology Conference (EPTC'03), December 10-12, 2003, Singapore; Mahadevan Iyer, iyer@ime.a-star.edu.sg, fax +65 6774 5747.

2004

**Int'l IEEE Confer on Asian Green Electronics (AGEC), January 5-9, 2004; Hong Kong/Shenzhen, China; Angie Wong, wywong@ee.cityu.edu.hk

**2004 IEEE/CPMT 20th Semiconductor thermal Measurement & Management Symposium (SEMI-THERM), March 9-11, 2004, San Jose, cscomm@earthlink.net

**1st International Workshop in Nano Bio-Packaging, May 22-23, 2004; Atlanta GA, wlp@ee.gatech.edu

**2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop (ASMC), May 4-6, 2004, Boston, mkindling@semi.org

**54th Electronic Components and Technology Conference (ECTC), June 1-4, 2004, Las Vegas NV, www.ectc.net

**Photomask Europa 2004, June 21-24, 2004, Dresden Germany

**2004 IEEE Holm Conference on Electrical Contacts, September 20-23, 2004, Seattle WA, Jennifer Lambert, j.lambert@ieee.org

-- submitted by Jim Morris, Vice President of Conferences