Japan Packaging Technolgy Seminar
June 16, 2003 -- Tokyo, Japan
The Japan Chapter of CPMT had the 3rd Japan Packaging Seminar on June 16, 2003, in Tokyo. The 150 attendees studied and discussed the main theme of the seminar: packaging technology for the mobile information era. The meeting had 6 technical presentations concerning: LTCC for automobiles, non-shrinkage LTCC, LTCC materials, cellular phone packaging, and software-wireless-telecommunication technology. Mr. Susumu Nishigaki of the Robert Bosh GmbH (Germany) received the electronic circuits packaging technology award from the chair of the Japan Chapter.
-- submitted by Nobuo Iwase, Secretariat, CPMT Society Japan Chapter.
Scene of the Seminar attendees
Chair M. Umeno gives the opening address