CPMT OFFICERS
President -- Rao Tummala, +1 404 894 9097
Technical VP -- Phil Garrou, +1 919 248 9261
Administration VP -- H. Anthongy Chan, +1 408 924 3656
Treasurer -- John Segelken, +1 540 961 1685
VP Publications -- Paul B. Wesling, +1 408 252 9051
VP Conferences -- James Morris, +1 607 777 4774
VP Education -- Albert Puttlitz, FAX +1 802 879 0466
Senior Past President -- Ralph Wyndrum, +1 732 219 0005
Junior Past President -- John Stafford, +1 602 413 5509
Secretary -- Ron Gedney, +1 703 834 2084
Executive Director -- Marsha Tickman, +1 732 562 5529
IEEE VP TAB -- Ralph Wyndrum, +1 732 219 0005
Board of Governors, Elected Members at Large
2003
William D. Brown
Craig Gaw
Johan Liu
Ralph Russell
Tim Adams
C. P. Wong
Standing Committee
Chairpeople
Student Chapter Development -- William D. Brown, wdb@engr.uark.edu
Distinguished Speakers -- A. F. Puttlitz, FAX +1 802 879
0466
Fellows Search -- Rao Tummala, rao.tummala@ee.gatech.edu,
& David Palmer, d.palmer@ieee.org
Fellows -- C. P. Wong, cp.wong@ieee.org
Constituition & Bylaws -- Tony Mak, +1 972 371 4364,
t.mak@ieee.org
Finance -- Ralph Wyndrum, Jr., r.wyndrum@ieee.org
Long Range Planning -- Dennis Olsen, d.olsen@ieee.org
Standards -- "Jack" Balde, +1, 908 788 5190
IEEE Books & Cand D Magazine Editor, Joe Brewer, +1
386 445 2593, j.brewer@ieee.org
Membership -- Ralph Russell, cpmt-membership@ieee.org
Chapter Development -- Ralph Russell, II, see membership
Nominations -- John Segelken, +1 540 633 5781
International Relations -- Leo Feinstein, +1 508 870 0051;
Europe -- Ephraim Suhir, +1 908 582 5301; Far East -- W. T. Chen,
+65 874 8110
Joint Committee on Semiconductor Manufacturing -- G. C.
Cheek
Publications
CPMT SOCIETY NEWSLETTER
Editor: David W. Palmer, email: d.palmer@ieee.org, FAX +1 505
844 7011, Tel: +1 505 844 2138
Composition: Alina Deutsch, deutsch@us.ibm.com
Proofreading: S. Puccetti
CPMT Archival Publications
Publications VP: Paul Wesling, email: p.wesling@ieee.org, Tel:
+1 408 252 9051.
Transactions-CPT editor, Avram Bar-Cohen, Univ. of Maryland,
2181B artin Hall, College Park, MD 20742 USA, Tel: +1 301 405
3173; email barcohen@eng.umd.edu
Transactions-AdvP editor; G. Subbarayan, Purdue University,
ME Department, Tel: +1 765 494 9770; email ganeshs@ecn.purdue.edu
Transactions EPM editor, Walter Trybula, Tel +1 512 356
3306, email w.trybula@ieee.org
Technical Committees
TC-1 Electrical Contacts, Connectors and Cables--Gerald
Witter, Chugai, +1 708 244 6025
TC-2 Discrete and Integral Passive Components-Leonard Schaper,
Univ. of Arkansas, +1 501 575 8408
TC-3 IC and Package Assembly - Michele Berry, Intel, michele.j.berry@intel.com
TC-4 Manufacturing Design & Process-Walt Trybula, SEMATECH,
+1 512 356 3306
TC-5 Materials--Rajen Chanchani, Sandia Labs, +1 505 844
3482
TC-6 High Density PWB packaging -- Yoshitaka Fukuoka, weisti.fukuoka@rose.zero.ad.jp
TC-7 Environmental Stress & Reliability Test--Kirk
Gray, k.a.gray@ieee.org
TC-9 Thermal Management & Thermomechanical Design--Tony
Mak, Dallas Semi, +1 972 371 4364
TC-10 Fiber Optics & Photonics-Frank Shi, UC Irvine,
email: FGSHI@uci.edu
TC-11 Electrical Test -- Bruce Kim, Bruce.Kim@asu.edu,
Tel: +1 480 965 3749
TC-12 Electrical Design, Modeling and Simulation-- Madhavan
Swaminathan, G Tech, +1 404 894 3340
TC-13 Power Electronics Packaging--Doug Hopkins, SUNY Buffalo,
+1 607 729 9949
TC-14 Systems Packaging-John Segelken, jsegelken@Actmicrodeices.com,
and Connie Swager, swager@us.ibm.com
TC-16 RF and Wireless-- Craig Gaw, Motorola, +1 480 413
5920
TC-17 MEMS and Sensor Packaging-Eric Jung, IZM Berline,
email: erju@izm.fhg.de
TC-18 Wafer Level Packaging-Michael Toepper, IZM Berline,
toepper@izm.fhg.de
TC-19 Education--Rao Tummala, G Tech, +1 404 894 9097
TC-21 Green Electronics Manufacturing and Packaging, Hansjoerg
Griese, Email: griese@izm.fhg.de