International IEEE Conference on Asian Green Electronics (AGEC)

January 5-6, 2004, City University of Hong Kong, Hong Kong
January 7-9, 2004, Mission Hills Resort, Shenzhen, China

 

Theme & Purpose of the Conference

The purpose of the conference is to present the latest advancements in environmentally compatible electronics design, manufacturing and packaging technology. The goal is to help electronics companies design and manufacture green electronics products for the global market.

Hong Kong & Shenzhen's Electronics Industries

A global trend in today's electronics industry is the relocation of advanced production plants and processes to the Guangdong province in China and specifically to the city of Shenzhen bordering Hong Kong. Today, Shenzhen is the major electronic manufacturing hub of the world. Shenzhen provides the electronics industry with an abundant supply of inexpensive land, subsidized state-of-the-art factory leases and labor. China's World Trade Organization membership should further enable Shenzhen to continue providing electronics manufacturing services, as well as to move to the top of the electronics industrial product chain in all aspects of product development.

With 35% of total export in electronics, Hong Kong is a strong supporter of Shenzhen. In fact, Hong Kong provides design and analysis support to China's manufacturing. In addition, half of Hong Kong's electronics exports come from the electronic parts and components industry, of which the largest export item is electronic parts and accessories for computers, telecommunications and consumer products.

Abstracts and Papers

Papers are on the following topics:

Design for green electronics
Green manufacturing technologies including lead-free solders, conductive adhesives and other green technologies
Halogen free substrates
Environmentally Friendly Packaging and Design Technologies
Life Cycle Analysis and Assessment
Life Cycle Cost Analysis
Life Cycle Data Management