Professor Rao Tummala Awarded by IEEE

The IEEE EAB Major Educational Innovation Award recognizes IEEE members who have distinguished themselves for outstanding educational innovation in a field of interest of the IEEE. The award consists of $1000 and a brass and walnut plaque. The proposed citation read: For reforming Microsystems Packaging education by unparalleled, systematic and innovative approaches to courses, curricula, tracks, books, degrees and conferences while mentoring and catalyzing other centers of excellence around the world.

Rao has been the President of the CPMT for the last 4 years where he has guided the Society to encourage many universities to establish component, packaging, and manufacturing technology curriculum. He has recently authored the book "Fundamentals of Microsystems Packaging" which is used by many university students and working engineers to become knowledgeable in this new growing field. Rao received the award in Seattle on November 14th at the IEEE TAB meeting.

submitted by Angie Hughes, Georgia Institute of Technology