TC-6 Sets Up Workshop for next ECTC

CPMT Technical Committee (TC-6) meeting on High Density Board Packaging Technology was held on September 25th, 2003 at the Tokyo branch of IBIDEN co., Ltd. One of the major accomplishments was the detailed planning of a Workshop to be held in conjustion with the 2004 ECTC in Las Vegas.

TC-6 Small Workshop Program in conjunction with 2004 ECTC

Chairman Yoshitaka Fukuoka, Weisti
Co-chairman Kishio Yokouchi, Fujitsu Laboratories of America, Inc.

Presentations:

(1) "Recent Advances in Materials, Processes and High Density Structures at GT-PRC" by Venky Sundaram and Rao R Tummala, Georgia Institute of Technology.
(2) "Dielectric Materials for High Density Interconnect Technology"
by Masahiro Ito and Shunsuke Yokotsuka, Asahi Glass Co.,Ltd
(3) "IVH Multi-layer Printed Circuit Board with Polyimide Films"
by Akihito Kurosaka and Osamu Nakao, Fujikura Ltd.
(4) "Advanced Technology for High Density Substrate and Boards" by Yasuhito Takahashi, Fujitsu Microelectronics America, Inc.

(5) "High-Density and Hight-Frequency Silicon Substrate Technology for SiP" by Atsushi Takano and Yoshitaka Fukuoka,
Dai Nippon Printing Co.,ltd and *Weisti
(6) "Passive and Active Components Embedding Technology for High Density Substrate" by Masaaski Katsumata,
Matsushita Elecronic Compoinents Co.,Ltd.
(7) "A Consideration for Total Mechanical Stress in Flip Chip Packaging Utilizing Buildup Substrate Technology"
by Yutaka Tsukada, Kyocera SLC Technologies corp.

The Attendees of this TC-6 meeting were: Dr. Yoshitaka Fukuoka (Weisti), Mr. Ryo Enomoto (IBIDEN Co., Ltd.), Mr. Shuhei Tsuchida (Kyocera SLC Technologies Co.), Mr. Rokuro Kambe (NGK Spark Plug Co., Ltd.), Mr Atsushi Takano (Dai Nippon Printing Co., Ltd), Mr. Shunsuke Yokotsuka (Asahi Glass Co., Ltd.), Mr. Masaaki Katsumata (Matsusita Electronic Components Co., Ltd.), Mr. Kishio Yokouchi--by long distance (Fujitsu Laboratories of America, Inc).